Výsledky vyhledávání - "Naohito Ogiso"

Analysis of Post-Chemical-Mechanical-Polishing Cleaning Mechanisms for Improving Time-Dependent Dielectric Breakdown Reliability

Autor: Yasuhito Yagi, Yohei Yamada, Junji Noguchi, Nobuhiro Konishi, Naohito Ogiso, Tadakazu Miyazaki, Shoji Asaka, Kiyomi Katsuyama

Publikováno v: Journal of The Electrochemical Society. 155:H301

Using Cu/SiOC interconnects, we investigated the relationship between the time-dependent dielectric breakdown (TDDB) reliability and the cleaning process in copper chemical-mechanical polishing (CMP). We found that the formation of a nonuniform coppe

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::7b23dddb2cc6a118180dcaa3f6231282
https://doi.org/10.1149/1.2888470

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Akademický článek

Time-frequency analysis reveals an association between the specific nuclear magnetic resonance (NMR) signal properties of serum samples and arteriosclerotic lesion progression in a diabetes mouse model.

Autor: Yui, Kanako¹ (AUTHOR), Kanawaku, Yoshimasa² (AUTHOR) ykanawaku@nms.ac.jp, Morita, Akio³ (AUTHOR), Hirakawa, Keiko⁴ (AUTHOR), Cui, Fanlai² (AUTHOR)

Publikováno v: PLoS ONE. 3/8/2024, Vol. 19 Issue 3, p1-17. 17p.

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Conference

Influence of Chemical-Mechanical Polishing Process on Time Dependent Dielectric Breakdown Reliability of Cu/Low-k Integration.

Autor: Yamada, Yohei, Konishi, Nobuhiro

Publikováno v: MRS Online Proceedings Library; 2009, Vol. 1157 Issue 1, p1-12, 12p

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