Zobrazeno 1 - 10
of 33
pro vyhledávání: '"Nancy Iwamoto"'
Autor:
Nancy Iwamoto, Guoqi Zhang, Cadmus Yuan, Shaorui Yang, Olaf van der Sluis, Jianmin Qu, Willem van Driel
Publikováno v:
Nanopackaging: nanotechnologies and electronics packaging, 129-183
ISSUE=2;STARTPAGE=129;ENDPAGE=183;TITLE=Nanopackaging
Nanopackaging ISBN: 9783319903613
Nanopackaging: Nanotechnologies and Electronics Packaging, Second Edition
Nanopackaging
ISSUE=2;STARTPAGE=129;ENDPAGE=183;TITLE=Nanopackaging
Nanopackaging ISBN: 9783319903613
Nanopackaging: Nanotechnologies and Electronics Packaging, Second Edition
Nanopackaging
Adhesion and delamination have been pervasive problems hampering the performance and reliability of micro-and nano-electronic devices. In order to understand, predict, and ultimately prevent interface failure in electronic devices, development of acc
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::012fcda50f2e93e82fc677deaf9203e0
https://research.tue.nl/nl/publications/306f0b23-d066-4fe5-87bf-c5d9f5e6115a
https://research.tue.nl/nl/publications/306f0b23-d066-4fe5-87bf-c5d9f5e6115a
Autor:
Nancy Iwamoto
Publikováno v:
2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
Unless hermetically sealed, one issue that will always be a concern for any polymer used in electronics is the effect of water on the physical properties of the polymers used, and the reliability of the final composite structure. Over the years, mole
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7464f4a596cd77c01f16f94fd4091e8c
https://doi.org/10.1109/ectc.2018.00250
https://doi.org/10.1109/ectc.2018.00250
Autor:
Nancy Iwamoto
Publikováno v:
2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
Until materials and material strategies are developed that can ignore the effects of moisture, one issue that will always be a concern for any polymer used in electronics is the effect of water on the polymer's physical properties (both its' final fu
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::73463e4494b73195d78198164b2080f7
https://doi.org/10.1109/eurosime.2018.8369903
https://doi.org/10.1109/eurosime.2018.8369903
Publikováno v:
2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
Although the area of flexible circuits is not new, current display and portable electronics consumer markets are driving device and packaging designs that will require increasingly higher robustness, especially as more devices are driven toward light
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3f4fc14be77da75788945311277891be
https://doi.org/10.1109/eurosime.2017.7926216
https://doi.org/10.1109/eurosime.2017.7926216
Autor:
Nancy Iwamoto
Publikováno v:
Microelectronics Reliability. 53:1101-1110
This paper addresses use of coarse-grained mesoscale model to look at angle dependencies in an epoxy–copper (I) oxide interface in order to understand roughness effects on adhesion. The parameterizations of the coarse-grained beads were previously
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::92307ae9183c9c4fa598673e57f85187
https://doi.org/10.1016/j.microrel.2013.02.015
https://doi.org/10.1016/j.microrel.2013.02.015
This book offers readers a snapshot of the progression of molecular modeling in the electronics industry and how molecular modeling is currently being used to understand materials to solve relevant issues in this field. The reader is introduced to th
Autor:
Nancy Iwamoto
Publikováno v:
Microelectronics Reliability. 52:1291-1299
Developing the stress response using the molecular and mesoscale levels is fairly reliable during the initial strain. For instance, modulus is a property that can be established using these techniques and the continuity of scale between the molecular
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::923d1189539fe369df8073b32b589639
https://doi.org/10.1016/j.microrel.2012.03.014
https://doi.org/10.1016/j.microrel.2012.03.014
Publikováno v:
Molecular Simulation. 37:710-717
With the increasing complexity and ongoing miniaturisation of microelectronic systems, reliability issues and their associated structural dimensions cross over from the microscale to the nanoscale. From this perspective, fracture of materials and mat
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::46ff286503a7b33e4ad3bd467e1ce284
https://doi.org/10.1080/08927022.2011.551882
https://doi.org/10.1080/08927022.2011.551882
Autor:
Nancy Iwamoto
Publikováno v:
Microelectronics Reliability. 51:1035-1045
The current paper successively applies molecular modeling and mesoscale modeling to scale mechanical models from an atomistic angstrom level to a sub-micron level and determine modulus, stress/strain behavior and defect formation in an epoxy and epox
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4ceb05a5c8356cc787543478d82073fa
https://doi.org/10.1016/j.microrel.2011.03.013
https://doi.org/10.1016/j.microrel.2011.03.013
Autor:
Nancy Iwamoto
Publikováno v:
International Symposium on Microelectronics. 2011:000657-000664
Deeper understanding of material failure must include consideration of contributions from the molecular and atomistic scales from which a more complete root cause picture may be constructed. The current study, supported by an international consortium
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::46bf4afbd771cc97b7d053e271a0f3b3
https://doi.org/10.4071/isom-2011-wp1-paper1
https://doi.org/10.4071/isom-2011-wp1-paper1