Zobrazeno 1 - 5
of 5
pro vyhledávání: '"Nan-sheng Wan"'
Autor:
Jing Zhang, Yan Zhuang, Nan-sheng Wan, Xin Tang, Wei Zhou, Liang Si, Yan Wang, Bao-yuan Chen, Jie Cao
Publikováno v:
Journal of International Medical Research, Vol 48 (2020)
Objective This study aimed to examine the association between slow-wave sleep ([SWS] N3 stage) and the risk of hypertension in patients with obstructive sleep apnea (OSA) or primary snorers. Methods A retrospective cross-sectional study of 1145 parti
Externí odkaz:
https://doaj.org/article/40dfda76fe9a474a9daf15df9ec3bc1c
Publikováno v:
Zhonghua yi xue za zhi. 93(6)
To explore the impact of chronic intermittent hypoxia (CIH) upon rat liver lipid metabolism and effect of anti-oxidant Tempol.Male Wistar rats (n = 80) were randomly divided into intermittent hypoxia group (10, 20, 30, 40 times/h), intermittent hypox
Publikováno v:
Zhonghua jie he he hu xi za zhi = Zhonghua jiehe he huxi zazhi = Chinese journal of tuberculosis and respiratory diseases. 35(1)
To observe the changes of blood pressure and sympathetic nerve activity under different degrees of chronic intermittent hypoxia (CIH) in rats, and therefore to explore the effects of CIH on blood pressure and sympathetic nerve activity and the correl
Autor:
Wei Zhou, Xuehan Qian, Jing Feng, Nan-sheng Wan, Bao-yuan Chen, Zhen Zhang, Run Guo, Yan Zhang, Shuo Li
Publikováno v:
Swiss medical weekly. 141
OBJECTIVE To study the systemic production of inflammatory factors and activation of transcription factor nuclear factor kappa B (NF-κB) in response to different levels of intermittent hypoxia and time. METHODS A total of 160 male Wistar rats were d
Autor:
NAN-SHENG WANG, 王南盛
87
Recently, interconnection and packaging technology have become the bottleneck when package density and clock increased on an electronic system. The Multi-Chip Module(MCM)packing has significantly improvement on wire density, high speed system
Recently, interconnection and packaging technology have become the bottleneck when package density and clock increased on an electronic system. The Multi-Chip Module(MCM)packing has significantly improvement on wire density, high speed system
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/05314882425482050107