Zobrazeno 1 - 10
of 21
pro vyhledávání: '"Nam Gutzeit"'
Publikováno v:
IEEE Access, Vol 12, Pp 63644-63654 (2024)
Estimating the Time Difference of Arrival (TDoA), is a simple yet reliable technique to accurately perform an indoor monostatic localization. To implement TDoA estimation, one approach is to utilize a broadband radar system equipped with multiple rec
Externí odkaz:
https://doaj.org/article/8ac8e3f6418a4782817d45a29961638f
Publikováno v:
Sustainable Energy & Fuels. 6:2330-2342
An improved heat guide Ag/AgPd metal-based Y-type thermoelectric generator (TEG) for converting automotive waste heat into electricity has been designed, analyzed, and manufactured with a low-cost LTCC technology.
Publikováno v:
2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC).
The paper presents actual results and applications of the developed picosecond laser structuring technology for low temperature cofired ceramics (LTCC). Standard screen-printed thick films on LTCC are ablated in the green and fired state for buried s
Autor:
Jens Muller, Nam Gutzeit, Reiner. S. Thoma, Christoph Wagner, Kurt Blau, Alexander Schulz, Matthias Hein, Steffen Spira
Publikováno v:
2018 Asia-Pacific Microwave Conference (APMC).
A millimeter wave multi-beam directional and full polarimetric agile front-end module for 5th generation of wireless communications is presented. Active voltage summing was used for the lossless rotation of polarization enhancing the envisaged flexib
Autor:
Ayda Boughamoura, Jens Muller, Fares Tounsi, Brahim Mezghani, Ammar B. Kouki, Björn Müller, Nesrine Jaziri, Nam Gutzeit
Publikováno v:
Applied Thermal Engineering. 184:116367
This paper investigates the optimal design permitting to recover thermal heat released from electronic power components mounted on ceramic substrates. Accordingly, the methodology and the characterization of thick-film/LowTemperature Co-fired Ceramic
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2016:000103-000106
In this publication the results of laser structuring processes of LTCC substrates, screen printed and laser structured gold thick film lines and the processing procedures are presented. To investigate the compatibility of the laser processes into the
Publikováno v:
2018 IMAPS Nordic Conference on Microelectronics Packaging (NordPac).
Among other virtues like good microwave performance, high density of integration, good thermal conductivity, hermeticity, and robustness, LTCC technology (Low Temperature Co-fired Ceramic) facilitates the integration of passive components like resist
Publikováno v:
2018 IMAPS Nordic Conference on Microelectronics Packaging (NordPac).
Integrated circuits packaged as commercial of the shelf components (COTS) are usually designed for robust handling in standard SMT-processes. They are often too bulky to be embedded in a multilayer PCB and pose limitations for higher component densit
Autor:
Tilo Welker, Sumy Mathew, Steffen Spira, Nam Gutzeit, Ralf Stephan, Jens Muller, Matthias Hein
Publikováno v:
2017 47th European Microwave Conference (EuMC).
In the context of the augmented demand for high capacity and uninterrupted communication links, radio-over-fiber technology provides advantage in terms of reduced power dissipation and broad operational frequency bandwidth. In such a link, a vertical
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2015:000062-000066
The integration density in semiconductor devices is significantly increased in the last years. This trend is already described by Moore's law what forecasts a doubling of the integration density every two years. This evolution makes greater demands o