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Publikováno v:
IEEE Sensors Journal. 21:23390-23399
This paper presents multisensor image fusion of polarization and infrared imaging to detect defects in printed circuit boards (PCBs). Many existing automated optical inspection techniques rely on visible imaging sensors. However, collected images suf
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::18eb6407c251e22b5de564345ceb3c57
https://doi.org/10.1109/jsen.2021.3106057
https://doi.org/10.1109/jsen.2021.3106057
