Zobrazeno 1 - 4
of 4
pro vyhledávání: '"Nagar, Mohan"'
Ultra large System-in-Package (SiP) module and novel packaging solution for networking applications.
Publikováno v:
2013 IEEE 63rd Electronic Components & Technology Conference; 2013, p694-701, 8p
Autor:
Ohta, Ryusuke, Nagar, Mohan, Ahmad, Mudasir, Tamagawa, Michiaki, Miyata, Katsumi, Suzuki, Takuya
Publikováno v:
2012 2nd IEEE CPMT Symposium Japan; 2012, p1-4, 4p
Autor:
Savic, John, Nagar, Mohan, Xie, Weidong, Ahmad, Mudasir, Senk, David, Bansal, Anurag, Islam, Nokibul, Oh, Park Gun, Pendse, Raj, HangChul, Choi, SangHo, Lee
Publikováno v:
2012 IEEE 62nd Electronic Components & Technology Conference; 1/ 1/2012, p450-456, 7p
Autor:
Savic, John, Aria, Percy, Priest, Judy, Ahmad, Mudasir, Hubbard, Ken, Pomerleau, Real, Teng, Sue, Nagar, Mohan, Xue, Jie
Publikováno v:
2010 Proceedings 60th Electronic Components & Technology Conference (ECTC); 2010, p1139-1146, 8p