Zobrazeno 1 - 10
of 240
pro vyhledávání: '"Nafis S"'
Publikováno v:
2021 IEEE PES Innovative Smart Grid Technologies - Asia (ISGT Asia).
Autor:
Leroi, I., Chaudhry, N., Daniel, A., Dunne, R., Eman, S., Farina, N., Haidry, S., Husain, N., Jafri, H., Karim, S., Kiran, T., Khan, M., Khan, Q., Malik, S.J., Memon, R., Rana, M.H., Sathish, A., Sheikh, S., Tamizudin, A., Tofique, S., Zadeh, Z., Abbasi, Y., Eitesam, S., Jafri, M., Khaliq, A., Karim, R., Nafis, S., Wasay, M.
Objective\ud \ud To produce a strategic roadmap for supporting the development of dementia research in Pakistan.\ud \ud \ud \ud Background\ud \ud While global research strategies for dementia research already exist, none is tailored to the specific n
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=core_ac_uk__::206e6d806c210b320da40b8309d1ff26
Autor:
Muzaffar, Aiman1 aimanmuzaffar14@gmail.com, Nafis, Md. Tabrez1 tabrez.nafis@gmail.com, Sohail, Shahab Saquib1 shahabssohail@jamiahamdard.ac.in
Publikováno v:
Neutrosophic Sets & Systems. 2020, Vol. 35, p239-251. 13p.
Autor:
Hajibarat, Zahra1 (AUTHOR), Saidi, Abbas1 (AUTHOR) abbas.saidi@gmail.com, Zeinalabedini, Mehrshad2 (AUTHOR) m_zeinalabedini@yahoo.com, Shariati, Vahid3 (AUTHOR), Mousapour Gorji, Ahmad4 (AUTHOR), Ghaffari, Mohammad Reza2 (AUTHOR)
Publikováno v:
Crop & Pasture Science. 2024, Vol. 75 Issue 10, p1-13. 13p.
Autor:
Sellmyer, D. J., Nafis, S.
Publikováno v:
Journal of Applied Physics; 4/15/1985, Vol. 57 Issue 8, p3584, 5p, 1 Diagram, 7 Graphs
Autor:
Igene, Morris1 (AUTHOR) morris.igene@ttu.edu, Luo, Qiyang1 (AUTHOR), Jimee, Keshav1 (AUTHOR), Soltanirad, Mohammad1 (AUTHOR), Bataineh, Tamer1 (AUTHOR), Liu, Hongchao1 (AUTHOR) hongchao.liu@ttu.edu
Publikováno v:
Sensors (14248220). Jul2024, Vol. 24 Issue 13, p4393. 20p.
Autor:
Wygant, Ira O., Jamal, Nafis S., Lee, Hyunjoo J., Nikoozadeh, Amin, Zhuang, Xuefeng, Oralkan, Ömer, Ergün, Arif Sanlı, Karaman, Mustafa, Khuri-Yakub, Butrus Thomas
This work was funded by NIH grant CA99059. National Semiconductor (Santa Clara, Ca) provided valuable circuit design support and fabricated the integrated circuits. Pac Tech USA Inc. (Santa Clara, Ca) provided solder-jetting and electroless Ni/Au bum
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=od______3401::b78ecc9c40c5d75d6331373b8fcf21d3
https://hdl.handle.net/11729/1809
https://hdl.handle.net/11729/1809
Publikováno v:
Journal of Applied Physics; 11/15/1988, Vol. 64 Issue 10, p5835, 3p, 1 Black and White Photograph, 3 Graphs
Publikováno v:
Journal of Applied Physics; 4/15/1988, Vol. 63 Issue 8, p3218, 3p
Publikováno v:
Journal of Applied Physics; 4/15/1988, Vol. 63 Issue 8, p3743, 3p, 1 Chart, 4 Graphs