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Publikováno v:
2017 IEEE 19th Electronics Packaging Technology Conference (EPTC).
Spin-on passivation polymers are now widely used in Wafer Level Packaging (WLP) to comply with new stress and reliability requirements of 3D-IC process integrations. In a first study a robust spin-on dielectric polymer characterization protocol — a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2ceabb92c5afa30316515e958659a01d
https://doi.org/10.1109/eptc.2017.8277477
https://doi.org/10.1109/eptc.2017.8277477
