Zobrazeno 1 - 10
of 13
pro vyhledávání: '"Na SR"'
Publikováno v:
Progress in Cryptology - AFRICACRYPT 2014; 2014, p178-198, 21p
Publikováno v:
Information Security (9783642333828); 2012, p322-337, 16p
Autor:
Na sr, Nezar, Steegmans, Eric
Publikováno v:
Information Security Theory & Practice. Security, Privacy & Trust in Computing Systems & Ambient Intelligent Ecosystems; 2012, p113-127, 15p
Akademický článek
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Autor:
Man Q; General Surgery, Tongliao City Hospital, Tongliao, Inner Mongolia, 028000, China., Zhang G; General Surgery, Tongliao City Hospital, Tongliao, Inner Mongolia, 028000, China., Chen X; Department of Gastroenterology, Tongliao City Hospital, Tongliao, Inner Mongolia, 028000, China., Na SR; Department of Pathology, Tongliao City Hospital, Tongliao, Inner Mongolia, 028000, China., Bai S; General Surgery, Tongliao City Hospital, Tongliao, Inner Mongolia, 028000, China., Zhi H; Department of Gastroenterology, Tongliao City Hospital, Tongliao, Inner Mongolia, 028000, China., Sun L; Department of Gastroenterology, Tongliao City Hospital, Tongliao, Inner Mongolia, 028000, China., Pang H; Department of Gastroenterology, Tongliao City Hospital, Tongliao, Inner Mongolia, 028000, China.
Publikováno v:
Journal of Cancer [J Cancer] 2024 Jan 01; Vol. 15 (4), pp. 1030-1040. Date of Electronic Publication: 2024 Jan 01 (Print Publication: 2024).
Autor:
Cho JH; Department of Mechanical Engineering, The University of Texas at Austin, Austin, TX 78712, United States of America., Na SR, Park S, Akinwande D, Liechti KM, Cullinan MA
Publikováno v:
Nanotechnology [Nanotechnology] 2019 Jun 07; Vol. 30 (23), pp. 235602. Date of Electronic Publication: 2019 Feb 19.
Autor:
Na SR; Department of Aerospace Engineering and Engineering Mechanics, The University of Texas at Austin, Austin, Texas, 78712, USA., Kim Y; SKKU Advanced Institute of Nanotechnology, Sungkyunkwan University, Suwon, Gyeonggi-do, 16419, Republic of Korea., Lee C; SKKU Advanced Institute of Nanotechnology, Sungkyunkwan University, Suwon, Gyeonggi-do, 16419, Republic of Korea. peterlee@skku.edu.; School of Mechanical Engineering, Sungkyunkwan University, Suwon, Gyeonggi-do, 16419, Republic of Korea. peterlee@skku.edu., Liechti KM; Department of Aerospace Engineering and Engineering Mechanics, The University of Texas at Austin, Austin, Texas, 78712, USA. kml@mail.utexas.edu., Suk JW; School of Mechanical Engineering, Sungkyunkwan University, Suwon, Gyeonggi-do, 16419, Republic of Korea. jwsuk@skku.edu.
Publikováno v:
Scientific reports [Sci Rep] 2017 Nov 07; Vol. 7 (1), pp. 14740. Date of Electronic Publication: 2017 Nov 07.
Autor:
Cho JH; Department of Mechanical Engineering, The University of Texas at Austin, Austin, TX 78712., Gorman JJ; National Institute of Standards and Technology, Gaithersburg, MD 20899., Na SR; Department of Aerospace Engineering and Engineering Mechanics Research Center for the Mechanics of Solids, The University of Texas at Austin, Austin, TX 78712., Cullinan M; Department of Mechanical Engineering, The University of Texas at Austin, Austin, TX 78712.
Publikováno v:
Carbon [Carbon N Y] 2017 May; Vol. 115, pp. 441-448. Date of Electronic Publication: 2017 Jan 11.
Autor:
Walker ES; Microelectronics Research Center and Department of Electrical and Computer Engineering, The University of Texas at Austin , Austin, Texas 78758, United States., Na SR; Research Center for the Mechanics of Solids, Structures and Materials and Department of Aerospace Engineering and Engineering Mechanics, The University of Texas at Austin , Austin, Texas 78712, United States., Jung D; Department of Electrical Engineering, Yale University , New Haven, Connecticut 06520, United States., March SD; Microelectronics Research Center and Department of Electrical and Computer Engineering, The University of Texas at Austin , Austin, Texas 78758, United States., Kim JS; Microelectronics Research Center and Department of Electrical and Computer Engineering, The University of Texas at Austin , Austin, Texas 78758, United States., Trivedi T; Microelectronics Research Center and Department of Electrical and Computer Engineering, The University of Texas at Austin , Austin, Texas 78758, United States., Li W; Microelectronics Research Center and Department of Electrical and Computer Engineering, The University of Texas at Austin , Austin, Texas 78758, United States., Tao L; Microelectronics Research Center and Department of Electrical and Computer Engineering, The University of Texas at Austin , Austin, Texas 78758, United States., Lee ML; Department of Electrical Engineering, Yale University , New Haven, Connecticut 06520, United States.; Department of Electrical and Computer Engineering, The University of Illinois at Urbana-Champaign , Urbana, Illinois 61801, United States., Liechti KM; Research Center for the Mechanics of Solids, Structures and Materials and Department of Aerospace Engineering and Engineering Mechanics, The University of Texas at Austin , Austin, Texas 78712, United States., Akinwande D; Microelectronics Research Center and Department of Electrical and Computer Engineering, The University of Texas at Austin , Austin, Texas 78758, United States., Bank SR; Microelectronics Research Center and Department of Electrical and Computer Engineering, The University of Texas at Austin , Austin, Texas 78758, United States.
Publikováno v:
Nano letters [Nano Lett] 2016 Nov 09; Vol. 16 (11), pp. 6931-6938. Date of Electronic Publication: 2016 Oct 24.
Autor:
Na SR; Department of Aerospace Engineering and Engineering Mechanics, Research Center for the Mechanics of Solids, Structures and Materials, and ‡The Materials Science and Engineering Program, The University of Texas at Austin , Austin, Texas 78712, United States., Wang X; Department of Aerospace Engineering and Engineering Mechanics, Research Center for the Mechanics of Solids, Structures and Materials, and ‡The Materials Science and Engineering Program, The University of Texas at Austin , Austin, Texas 78712, United States., Piner RD; Department of Aerospace Engineering and Engineering Mechanics, Research Center for the Mechanics of Solids, Structures and Materials, and ‡The Materials Science and Engineering Program, The University of Texas at Austin , Austin, Texas 78712, United States., Huang R; Department of Aerospace Engineering and Engineering Mechanics, Research Center for the Mechanics of Solids, Structures and Materials, and ‡The Materials Science and Engineering Program, The University of Texas at Austin , Austin, Texas 78712, United States., Willson CG; Department of Aerospace Engineering and Engineering Mechanics, Research Center for the Mechanics of Solids, Structures and Materials, and ‡The Materials Science and Engineering Program, The University of Texas at Austin , Austin, Texas 78712, United States., Liechti KM; Department of Aerospace Engineering and Engineering Mechanics, Research Center for the Mechanics of Solids, Structures and Materials, and ‡The Materials Science and Engineering Program, The University of Texas at Austin , Austin, Texas 78712, United States.
Publikováno v:
ACS nano [ACS Nano] 2016 Oct 25; Vol. 10 (10), pp. 9616-9625. Date of Electronic Publication: 2016 Sep 27.