Zobrazeno 1 - 10
of 37
pro vyhledávání: '"N.R. Basavanhally"'
Publikováno v:
IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B. 19:107-115
Array surface active devices such as self-electrooptic effect devices (SEEDs) and surface emitting lasers (SELs) are being considered increasingly for parallel interconnection technology. Because these are optical devices, it is necessary to provide
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::44753f20c3de9b53bf9b6cb5f112f51e
https://doi.org/10.1109/96.486492
https://doi.org/10.1109/96.486492
Publikováno v:
IEEE Transactions on Components, Hybrids, and Manufacturing Technology. 16:783-788
Demands for increased interconnection density and higher bandwidth, coupled with the stringent cost constraints of advanced wide-bandwidth telecommunication switching and high-throughput computer architectures, are exhausting conventional electrical
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d1cbc2106b3f037056de735fb266b4ec
https://doi.org/10.1109/33.273674
https://doi.org/10.1109/33.273674
Publikováno v:
IEEE Transactions on Components, Hybrids, and Manufacturing Technology. 15:972-976
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d2855498cc533e3590f23f5bcea47578
https://doi.org/10.1109/33.206919
https://doi.org/10.1109/33.206919
Publikováno v:
The 17th Annual Meeting of the IEEELasers and Electro-Optics Society, 2004. LEOS 2004..
The typical fiber array specifications for optical cross connect switches and the fabrication and performance of two-dimensional fiber arrays are presented in this paper. Several designs of systems with fiber arrays are presented. Data on the environ
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::81f6517a4bb4c1348a2763ca2b556949
https://doi.org/10.1109/leos.2004.1363411
https://doi.org/10.1109/leos.2004.1363411
Publikováno v:
1992 Proceedings 42nd Electronic Components & Technology Conference.
Feasibility study results on direct chip interconnection (DCI) using anisotropic conductive polymer material on both flexible and rigid substrates are discussed. The concept is to simultaneously attach and electrically interconnect IC chips to circui
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d7b1c28a367ba76f8f446e1db0fabebd
https://doi.org/10.1109/ectc.1992.204250
https://doi.org/10.1109/ectc.1992.204250
Publikováno v:
Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93).
Demands for increased interconnection density and higher bandwidth, coupled with stringent cost constraints of advanced wide bandwidth telecommunication switching and high throughput computer architectures, are exhausting conventional electrical inte
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3e853f3dccaab0ffe0deed58e9cca2ed
https://doi.org/10.1109/ectc.1993.346758
https://doi.org/10.1109/ectc.1993.346758
Publikováno v:
Proceedings of LEOS'94.
Summary form only given. A packaging scheme which provides both optical alignment and electrical interconnection during a single assembly process for SEED chip has been presented. The assembly of the package is cost-effective because the design lends
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::968a4e90c7f1aa314de75f744cfa84e8
https://doi.org/10.1109/leos.1994.586969
https://doi.org/10.1109/leos.1994.586969
Publikováno v:
1991 Proceedings 41st Electronic Components & Technology Conference.
A fluxless repair process for flip-chip multichip modules (MCMs) is demonstrated. The process includes steps for removing defective chips, reducing and leveling solder at the chip site, and retacking a new, good chip in its place. After chip removal,
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::356390b4eeb98894d04e0133ed2ba3aa
https://doi.org/10.1109/ectc.1991.163968
https://doi.org/10.1109/ectc.1991.163968
Autor:
J. Kim, C.J. Nuzman, B. Kumar, D.F. Lieuwen, J.S. Kraus, A. Weiss, C.P. Lichtenwalner, A.R. Papazian, R.E. Frahm, N.R. Basavanhally, D.A. Ramsey, V.A. Aksyuk, F. Pardo, M.E. Simon, V. Lifton, H.B. Chan, M. Haueis, A. Gasparyan, H.R. Shea, S. Arney
Publikováno v:
IEEE Photonics Technology Letters; Nov2003, Vol. 15 Issue 11, p1537-1539, 3p