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pro vyhledávání: '"N.C. Tien"'
Akademický článek
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Conference
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Publikováno v:
IEEE Transactions on Electron Devices. 51:74-82
The mutual inductance and self-inductance of global interconnects are important but difficult to extract and model in deep submicrometer very large scale integration (VLSI) designs. The absence of effective mutual magnetic field shielding limits the
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ce3bf68f4362d54d385c04b823f845fe
https://doi.org/10.1109/ted.2003.820683
https://doi.org/10.1109/ted.2003.820683
Publikováno v:
Journal of Microelectromechanical Systems. 9:281-287
Selective copper encapsulation on silicon has been used to fabricate micromachined devices such as inductors with quality factors over 30 at frequencies above 5 GHz. The devices are fabricated using either polysilicon surface micromachining, or integ
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::903b2f9abc98cae7cf1992f8b4e82609
https://doi.org/10.1109/84.870052
https://doi.org/10.1109/84.870052
Publikováno v:
IEEE Transactions on Microwave Theory and Techniques. 48:2415-2423
A silicon micromachining method has been developed to fabricate on-chip high-performance suspended spiral inductors. The spiral structure of an inductor was formed with polysilicon and was suspended over a 30-/spl mu/m-deep cavity in the silicon subs
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e363ff9c3533ef7a7d7c7155d8c6f989
https://doi.org/10.1109/22.898992
https://doi.org/10.1109/22.898992
Publikováno v:
Journal of Microelectromechanical Systems. 8:456-465
This paper presents a fabrication process that integrates polysilicon surface micromachining and deep reactive ion etching (DRIE) bulk silicon micromachining. The process takes advantage of the design flexibility of polysilicon surface micromachining
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0761ffcaa7f31f40568039bcb83d4afa
https://doi.org/10.1109/84.809061
https://doi.org/10.1109/84.809061
Publikováno v:
2010 Solid-State, Actuators, and Microsystems Workshop Technical Digest.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::90238f392e2e233e729f9a3dc3bc7c59
https://doi.org/10.31438/trf.hh2010.122
https://doi.org/10.31438/trf.hh2010.122
Publikováno v:
Thin Solid Films. 196:295-303
We have investigated the luminescent and device properties of pseudomorphic AlGaAs/InGaAs modulation-doped field effect transistors (MODFETs) with different InAs molar fractions in the InGaAs channel. Molecular beam epitaxy, which simulataneously dep
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::01a9751e2a85f910f9c7ec60ac4bc3b0
https://doi.org/10.1016/0040-6090(91)90373-6
https://doi.org/10.1016/0040-6090(91)90373-6
Publikováno v:
Proceedings IEEE Micro Electro Mechanical Systems. 1995.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::bd182924ef0e193968c07768e8ddf2c9
https://doi.org/10.1109/memsys.1995.472554
https://doi.org/10.1109/memsys.1995.472554
Autor:
N.C. Tien, D.T. McCormick
Publikováno v:
2003 IEEE/LEOS International Conference on Optical MEMS (Cat. No.03EX682).
A MEMS based, resonant mode, thinned single crystal silicon scanning mirror stiffened by a skeleton truss and actuated via multi-layer vertical comb-drives has been realized utilizing a self-aligned DRIE fabrication process.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::35c1322841a90406399325b6afff0a2b
https://doi.org/10.1109/omems.2003.1233443
https://doi.org/10.1109/omems.2003.1233443