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pro vyhledávání: '"N. Li Pira"'
Akademický článek
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Publikováno v:
International Journal of Polymer Science, Vol 2018 (2018)
The antifingerprint properties of a range of surfaces produced with different technologies (in-mould decoration, in-mould labeling, and painted) were objectively evaluated by depositing on them in standard conditions an artificial fingerprint for dir
Externí odkaz:
https://doaj.org/article/37dca4f107914977afb474c64454a420
Akademický článek
Tento výsledek nelze pro nepřihlášené uživatele zobrazit.
K zobrazení výsledku je třeba se přihlásit.
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Autor:
Aldona Jagminiene, Eugenijus Norkus, N. Li Pira, Karolis Ratautas, Gediminas Račiukaitis, Ina Stankeviciene, U. Emanuele, Mindaugas Gedvilas, Stefano Sinopoli
Publikováno v:
2016 12th International Congress Molded Interconnect Devices (MID).
Fabrication of circuit traces is the most challenging task in the Molded Interconnection Device (MID) technology. The technical difficulties which can be met when producing conductive trace are spatial selectiveness and adhesion of a plated metal. On
Autor:
Gediminas Račiukaitis, Aldona Jagminienė, U. Emanuele, N. Li Pira, Ina Stankeviciene, Mindaugas Gedvilas, Eugenijus Norkus, Stefano Sinopoli, Karolis Ratautas
Publikováno v:
Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XXI.
Laser writing for selective plating of electro-conductive lines for electronics has several significant advantages, compared to conventional printed circuit board technology. Firstly, this method is faster and cheaper at the prototyping stage. Second
Autor:
Stefan Landis, S. Decossas, N. Li Pira, Vito Lambertini, N. Chaix, Corinne Perret, Cécile Gourgon
Publikováno v:
Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures. 26:2174-2178
Several nanoimprint lithography polymers have been investigated for optical applications. The objective was to establish which materials can be used as a permanent polymer coated on top of a glass substrate to provide nanostructures imprinted by nano
Autor:
A.K. Andreopoulou, M. Barbaro, M.J. Beliatis, A. Bonfiglio, B.S. Cook, J.R. Cooper, P. Cosseddu, B.W. D'Andrade, P. Delaporte, M. Demelas, D. Georgiou, S. Grigorian, G. Huebner, K.D.G.I. Jayawardena, J.K. Kallitsis, D. Karnakis, A.Z. Kattamis, S. Kim, C. Koidis, S. Kourkouli, M. Koyuncu, M. Krebs, F.C. Krebs, S. Lai, A. Laskarakis, Y. Leterrier, S. Logothetidis, A. Loi, E. Lorenz, M.F. Mabrook, C.A. Mills, P.F. Murphy, N. Li Pira, R. Rhodes, B. Roth, L.J. Rozanski, P.W. Sayers, S.R.P. Silva, A. Sleiman, R.R. Søndergaard, B. Tehrani, M.M. Tentzeris, G. Volonakis, Z.G. Wu, I. Zergioti, D.A. Zeze, A. Zimmermann
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::763b853951f048eaa4478dba6b692099
https://doi.org/10.1016/b978-1-78242-035-4.01002-2
https://doi.org/10.1016/b978-1-78242-035-4.01002-2
Autor:
N. Li Pira
This chapter discusses the manufacturing of integrated smart systems (ISS) enabling novel functionalities for the transportation field. An overview of the main challenging aspects for production of ISS based on flexible electronics building blocks is
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::cac0e76f7e5ed9204a2c29f0b65646dd
https://doi.org/10.1016/b978-1-78242-035-4.00014-2
https://doi.org/10.1016/b978-1-78242-035-4.00014-2
Autor:
D. A. Tsyrkunov, G. K. Maliarevich, Michel A. Aegerter, Jan Misiewicz, P. Repetto, N. V. Gaponenko, I. S. Molchan, N. Al-Dahoudi, Robert Kudrawiec, N. Li Pira, J. Puetz, V. Lambertini
Publikováno v:
Microelectronic Engineering. 81:255-261
Structures comprising a xerogel, doped with lanthanide ions (erbium, terbium and europium), embedded in porous anodic alumina (PAA) have been fabricated and their optical and electrical characteristics have been studied. Erbium photoluminescence at [
Autor:
G. C. Jalva, N. Schlaefli, P. Sánchez-Friera, Reiner Götzen, Helge Bohlmann, F. Berenguer, Matthias Burgard, J. Gourlay, David Gonzalez, N. Li Pira, R. Willmann, Paula Queipo, Werner Zapka
Publikováno v:
Proceedings of the 10th International Conference on Multi-Material Micro Manufacture.