Zobrazeno 1 - 10
of 79
pro vyhledávání: '"N. Furutake"'
Autor:
Yusuke Hayashi, Tsuneo Takeuchi, M. Tagami, M. Abe, Makoto Ueki, N. Furutake, Shuichi Saito, M. Narihiro, Munehiro Tada, T. Onodera, Naoya Inoue, H. Yamamoto, Fuminori Ito
Publikováno v:
IEEE Transactions on Electron Devices. 56:1579-1587
A low oxygen content (LOC) CuAl alloy with no barrier metal (Ta) oxidation was obtained using an oxygen absorption process based on metallurgical thermodynamic principles. LOC CuAl dual damascene interconnects (DDIs) were successfully implemented int
Autor:
Fuminori Ito, Hiroto Ohtake, Noriaki Oda, K. Arai, Munehiro Tada, Tsuneo Takeuchi, Yoshiko Kasama, M. Narihiro, T. Taiji, Yoshihiro Hayashi, M. Sekine, N. Furutake
Publikováno v:
IEEE Transactions on Electron Devices. 54:797-806
A feasibility study was done for 45-nm-node Cu interconnects using a novel molecular-pore-stacking (MPS) SiOCH film (k = 2.45), taking electron scattering in the scaled-down Cu lines into consideration. The as-deposited MPS SiOCH film, formed by plas
Autor:
Yoshihiro Hayashi, H. Sunamura, A. Mitsuiki, Takashi Hase, Y. Yabe, Toshiharu Nagumo, K. Uejima, A. Tanabe, K. Masuzaki, S. Saito, M. Narihiro, Koichi Takeda, M. Saitoh, Kiyoshi Takeuchi, Nobuyuki Ikarashi, T. Yamamoto, Makoto Ueki, N. Furutake
Publikováno v:
VLSIC
A low-power 2Mb ReRAM macro was developed in 90 nm CMOS platform, demonstrating lower power data-writing (x1/7) and faster data-reading (x2∼3) as compared to a conventional flash. The memory window at −6σ for 10 years was confirmed with a high-s
Autor:
M. Hiroi, Naoya Inoue, Yusuke Hayashi, T. Onodera, N. Furutake, Makoto Ueki, Nobuyuki Ikarashi
Publikováno v:
IEEE Transactions on Electron Devices. 51:1883-1891
We investigated the effects of a Ti addition on the reliability and the electrical performance of Cu interconnects, comparing three different ways of Ti addition such as A) Ti layer insertion under Ta-TaN stacked barrier metal, B) Ti layer insertion
Publikováno v:
Extended Abstracts of the 2014 International Conference on Solid State Devices and Materials.
Autor:
Yoshihiro Hayashi, S. Saito, M. Narihiro, Hiroshi Sunamura, Naoya Inoue, N. Furutake, Masami Hane
Publikováno v:
2014 Symposium on VLSI Technology (VLSI-Technology): Digest of Technical Papers.
Enhanced current drivability of BEOL-process-compatible dual-oxide complementary BEOL-FETs on LSI-interconnects (Fig. 1) with just two additional masks to the state-of-the-art BEOL process is demonstrated, aiming at high-V bd pre-driver operation. We
Autor:
S. Saito, Hiroshi Sunamura, M. Narihiro, Jun Kawahara, Kishou Kaneko, Naoya Inoue, Yoshihiro Hayashi, Masami Hane, N. Furutake
Publikováno v:
Extended Abstracts of the 2013 International Conference on Solid State Devices and Materials.
Publikováno v:
Extended Abstracts of the 2013 International Conference on Solid State Devices and Materials.
Autor:
S. Saito, Nobuyuki Ikarashi, M. Narihiro, Yoshihiro Hayashi, Hiroshi Sunamura, Masami Hane, Kishou Kaneko, N. Furutake
Publikováno v:
2012 International Electron Devices Meeting.
A new P-type amorphous SnO thin-film transistor with high I on /I off ratio of >104 is developed, for the first time, as a component to complement N-type IGZO transistors for on-chip voltage-bridging BEOL-CMOS I/Os on conventional Si-LSI Cu-interconn
Autor:
M. Narihiro, Hiroshi Sunamura, N. Furutake, S. Saito, Yoshihiro Hayashi, Masami Hane, Kishou Kaneko
Publikováno v:
2012 Symposium on VLSI Technology (VLSIT).
Functional circuit elements based on novel BEOL-transistors with a wide-band-gap oxide semiconductor InGaZnO (IGZO) film are integrated onto LSI Cu-interconnects, and their operations are demonstrated. High-current comb-type transistors show excellen