Výsledky vyhledávání

BIOCHEMICAL CHANGES IN AMERICAN ELDER (SAMBUCUS CANADENSIS) FRUITS DURING DEVELOPMENT

Autor: N. Chevrier, D. Charlebois, M. T. Charles, F. Mathieu

Publikováno v: Acta Horticulturae. :61-72

For two consecutive years, total soluble solids, anthocyanins, free phenolics, and antioxidant capacity (ABTS/TEAC method) of the fruit of one wild ecotype and five cultivars of American elder (Sambucus Canadensis) were evaluated during development.

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::b24d6074040de5f8045536e0bece2982
https://doi.org/10.17660/actahortic.2015.1061.5

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Thermo-mechanical assessment of copper and graphite heat spreaders for compact packages

Autor: Severine Cheramy, K. N. Assigbe, N. Chevrier, Alexis Farcy, Perceval Coudrain, Jean-Philippe Colonna, R. Prieto

Publikováno v: International Workshop on Thermal Investigations of IC´S and Systems
International Workshop on Thermal Investigations of IC´S and Systems, Sep 2016, Budapest, Hungary

Graphite-based materials have been proved to be an enhancement over copper heat spreaders when directly integrated at the silicon level. However, not only they outdo copper in terms of thermal performance, but their in-plane CTE (coefficient of therm

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::ca50080dfc2b4d5d6a0183f10b295ae8
https://doi.org/10.1109/therminic.2016.7748641

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Warpage reduction using dielectric layers stress tuning: From analytical model to 3D integration of large die on ceramic substrate

Autor: G. Imbert, Laetitia Castagne, Gilles Simon, F. Casset, Pascal Chevalier, N. Chevrier, B. Kholti, L. Toffanin, Sébastien Petitdidier, F. Bailly, Jp. Pierrel, D. Mermin, R. Franiatte, C. Ferrandon

Publikováno v: 2016 6th Electronic System-Integration Technology Conference (ESTC).

A mechanical study of silicon interposer bow reduction, from wafer level manufacturing to large die stacking including analytical modeling, is presented in this paper. Indeed, understanding and reducing the warpage of a dissymmetrical substrate is fu

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::5850f68bc6ecd5229641ea5556d1a7a1
https://doi.org/10.1109/estc.2016.7764485

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Stress management strategy to limit die curvature during silicon interposer integration

Autor: Alexis Farcy, Cedrick Chappaz, S. Escoubas, G. Lobascio, A. Ruckly, P. Chausse, Olivier P. Thomas, Vincent Fiori, N. Chevrier, B. Vianne, F. Ponthenier

Publikováno v: 3DIC

Die-level warpage is a challenging issue affecting silicon interposer assembly yield. Stress management strategies are required to compensate residual and thermo-mechanical stress occurring during silicon interposer integration and die stacking proce

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::10d007a928b1b47c257ca1caa03b436c
https://doi.org/10.1109/3dic.2015.7334622

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3D Integration of CMOS Image Sensor with Coprocessor Using TSV last and Micro-Bumps Technologies

Autor: Francis Calmon, Alexis Farcy, A. Berthelot, Thierry Lacrevaz, Ian O'Connor, N. Chevrier, P. Coudrain, Sophie Verrun, O. Le-Briz, N. Bouzaida, Bernard Flechet, Jean Charbonnier, G. Cibrario, D. Henry, L. Fourneaud, R. Franiatte

Publikováno v: IEEE 63rd Electronic Components and Technology Conf.
IEEE 63rd Electronic Components and Technology Conf., May 2013, Las Vegas, United States. pp.674-682

This paper presents the prototype of a 3D circuit in which a Wafer Level Packaged CMOS image sensor is vertically assembled with an image signal processor in a face-to-back integration scheme. The design flow used to hybrydize the two circuits will b

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::7d25cfe5fd1730fdf4cd764f23033d6f
https://hal.archives-ouvertes.fr/hal-01018405

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HERITABILITY OF IN VITRO REGENERATION IN WHEAT (Triticum aestivum L.)

Autor: K. K. Kartha, Pierre Hucl, J. A. Qureshi, N. Chevrier

Publikováno v: Canadian Journal of Plant Science. 70:547-550

This study measured the heritability of in vitro regeneration in wheat (Triticum aestivum L.). Immature embryos of 28 F2-derived families of the spring wheat cross HY912 × HY320 were cultured in the F3, F4, and F5 generations. Highly significant (P

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::06a97c46fe6a960b16c0fc8274764296
https://doi.org/10.4141/cjps90-067

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