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Autor:
Irman Abdul Rahman, K. Z. Ku Ahmad, N F N M Lehan, N S Sobri, Azman Jalar, Wan Yusmawati Wan Yusoff
Publikováno v:
Journal of Physics: Conference Series. 1816:012118
Microelectronic packaging is frequently used in almost every application involving radiation-related industry. In the present work, the effect of the low dose gamma radiation on hardness and microstructural properties of Sn3Ag0.5Cu solder was explore