Zobrazeno 1 - 10
of 293
pro vyhledávání: '"N Claret"'
Autor:
Crystal, David
Publikováno v:
The Oxford Dictionary of Original Shakespearean Pronunciation, 1 ed., 2016.
Externí odkaz:
http://www.oxfordreference.com/view/10.1093/acref/9780199668427.001.0001/acref-9780199668427-e-3133
Publikováno v:
IEEE Transactions on Device and Materials Reliability. 7:64-68
Electrical, electrooptical, mechanical, and microstructural characterizations explain why the leakage currents in advanced Cu/ultralow-interconnects can change from bulk (3-D) to mostly interfacial (2-D) above 150degC. A physical model consistent wit
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f3106cb102072d32f5af97c9936fbc6b
https://doi.org/10.1109/tdmr.2007.902172
https://doi.org/10.1109/tdmr.2007.902172
Publikováno v:
Microelectronic Engineering. 83:2175-2178
The electromigration-induced void dynamic in 120nm Cu lines is studied in situ inside a SEM. The evolutions of the void shape and growth rate are detailed, and compared to finite-element modeling (FEM). In the case of Cu/porous ULK lines with Ta/TaN
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0ee84259ba21bd6e4f55bfc07d03a0d6
https://doi.org/10.1016/j.mee.2006.09.029
https://doi.org/10.1016/j.mee.2006.09.029
Autor:
N. Claret, J.-L. Soubeyroux
Publikováno v:
Applied Physics A: Materials Science & Processing. 74:s1025-s1027
Crystallisation behaviour of some bulk metallic glasses has been studied by neutron diffraction and by differential scanning calorimetry (DSC) performed at the same heating rate. The alloys Zr51Ti2.5Al11.5Cu22Ni13 (F35) and Zr41.25Ti13.75Cu8Ni14.5Be2
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::749a7d09e96ccd2593d6bb181cf2ff86
https://doi.org/10.1007/s003390101181
https://doi.org/10.1007/s003390101181
Autor:
Lucile Arnaud, Joaquim Torres, C. Guedj, J.C. Barbe, N. Claret, G. Reimbold, F. Boulanger, J.P. Barnes, Gérard Passemard, M. Aimadeddine, Vincent Arnal
Publikováno v:
2006 IEEE International Reliability Physics Symposium Proceedings.
Electrical, electro-optical, mechanical and microstructural characterizations explain why the leakage currents in advanced Cu/ultra-low K interconnects can change from bulk (3D) to mostly interfacial (2D) above 150degC. A physical model consistent wi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9f4c42af6f928118762b779868ada267
https://doi.org/10.1109/relphy.2006.251269
https://doi.org/10.1109/relphy.2006.251269
Autor:
Li, Wenhao1 (AUTHOR), Liu, Kejun1 (AUTHOR), Liao, Xiaozu2 (AUTHOR), Li, Binfei2 (AUTHOR) yulu9047@126.com, Liang, Yi1 (AUTHOR) yiliangzscph@outlook.com, Huang, Weizhao1 (AUTHOR) garming97@126.com
Publikováno v:
Journal of Cardiothoracic Surgery. 5/31/2024, Vol. 19 Issue 1, p1-7. 7p.
Autor:
Nadalian, Bahareh1 (AUTHOR), Nadalian, Banafsheh1 (AUTHOR), Zali, Mohammad Reza2 (AUTHOR), Yadegar, Abbas1,3 (AUTHOR)
Publikováno v:
Canadian Journal of Infectious Diseases & Medical Microbiology. 5/24/2024, Vol. 2024, p1-11. 11p.
Autor:
N Claret, J.L Soubeyroux
Publikováno v:
Journal of Magnetism and Magnetic Materials. :1379-1380
The development of Fe- and Co- based amorphous soft magnetic materials with low critical cooling rate for glass formation with a wide supercooled liquid region before crystallization has become an important topic for fundamental as technological reas
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::cbf4644ba39d2d2ac78a86489ce66b07
https://doi.org/10.1016/j.jmmm.2003.12.112
https://doi.org/10.1016/j.jmmm.2003.12.112
Autor:
Kurek, Krzysztof1 (AUTHOR), Swieczkowski, Damian2 (AUTHOR), Pruc, Michal3,4 (AUTHOR), Tomaszewska, Monika1 (AUTHOR), Cubala, Wieslaw Jerzy5 (AUTHOR) cubala@gumed.edu.pl, Szarpak, Lukasz6,7,8 (AUTHOR) lukasz.szarpak@gmail.com
Publikováno v:
Journal of Clinical Medicine. Dec2023, Vol. 12 Issue 24, p7655. 18p.
Autor:
Santé-Lhoutellier, Véronique1 (AUTHOR) veronique.sante-lhoutellier@inrae.fr
Publikováno v:
Italian Journal of Animal Science. Dec2023, Vol. 22 Issue 1, p898-910. 13p.