Zobrazeno 1 - 10
of 98
pro vyhledávání: '"N A Fadil"'
Publikováno v:
Journal of Mechanical Engineering and Sciences, Vol 14, Iss 1, Pp 6504-6513 (2020)
The mechanical properties of the thin sputtered copper layer on the SiO2-coated silicon substrate is needed as part of the requirements in quantifying the reliability of the Through-Silicon Via (TSV) interconnects. In this respect, two different Cu c
Externí odkaz:
https://doaj.org/article/4b6977412f71448da91dacd3202bb97e
Publikováno v:
IOP Conference Series: Materials Science and Engineering. 1173:012039
Steel is the most widely used metal on earth, cheap and found everywhere. It has good properties such as machinability, strength, ductility, and compatibility with other materials. However, it has weakness such as high corrosion rate which need to im
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::dd92e35cba5ad80a75daade6aa013d07
https://doi.org/10.1088/1757-899x/1173/1/012039
https://doi.org/10.1088/1757-899x/1173/1/012039
Autor:
Rasa, Amir Rahmani1 (AUTHOR) rahmaniot@umsha.ac.ir, Borja, Alejandro L.1 (AUTHOR) alejandro.lucas@uclm.es
Publikováno v:
BioMed Research International. 12/17/2024, Vol. 2024, p1-19. 19p.
Autor:
Kandsi, Fahd1 (AUTHOR) kandsi.fahd@ump.ac.ma, Abdnim, Rhizlan1 (AUTHOR), Benkhaira, Nesrine2 (AUTHOR), Zahra Lafdil, Fatima1 (AUTHOR), Bnouham, Mohamed1 (AUTHOR), Yamani, Boutaina3 (AUTHOR), Naceiri Mrabti, Hanae4 (AUTHOR), Wondmie, Gezahign Fentahun5 (AUTHOR) resercherfent@gmail.com, Bin Jardan, Yousef A.6 (AUTHOR), Ibenmoussa, Samir7 (AUTHOR), El Hachlafi, Naoufal2 (AUTHOR)
Publikováno v:
International Journal of Food Properties. 2024, Vol. 27 Issue 1, p1150-1166. 17p.
Publikováno v:
IOP Conference Series: Materials Science and Engineering. 238:012001
Deposited tin (Sn) layers used as lead-free solderable finish on the semiconductor devices are known to form whiskers. These whiskers are a single crystal of tin that spontaneously grows from the surface of tin within weeks to years. Thus, they can c
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9d13896a7295089e10c1175a29122065
https://doi.org/10.1088/1757-899x/238/1/012001
https://doi.org/10.1088/1757-899x/238/1/012001
Publikováno v:
International Journal of Electrochemical Science. Oct2024, Vol. 19 Issue 10, p1-17. 17p.
Autor:
Taha, Sara K. H.1 akghm003@uokirkuk.edu.iq, Aljabary, Ali M. A. O.2 ali.omar@spu.edu.iq
Publikováno v:
Iraqi Journal of Agricultural Sciences. 2024, Vol. 55 Issue 3, p1147-1157. 11p.
Autor:
هدى سعد عبد اهلل 1 h.u.d.a.s.a.a.d.n@gmail.com, فهد بن أمحد بن حم 2 faalnaim@kfu.edu.sa
Publikováno v:
Journal of Educational Sciences. May2024, Vol. 36 Issue 2, p148-170. 23p.
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Autor:
Kumar, L. Govind Sanjeev1 govindsanjeev.safety@gmail.com, Thirumalaikumarasamy, D.1, Karthikeyan, K.2, Mathanbabu, M.3, Elango, E.4
Publikováno v:
International Journal of Vehicle Structures & Systems (IJVSS). 2024, Vol. 16 Issue 3, p405-412. 8p.