Zobrazeno 1 - 10
of 129
pro vyhledávání: '"Myung Jin Yim"'
Autor:
Sung-Soon Choi, Boo Taek Lim, Kisu Joo, Boung Ju Lee, Euijoon Yoon, Tae-Ryong Kim, Se Young Jeong, Myung Jin Yim
Publikováno v:
2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
In this study, an alumina coated silver core/shell structure particles were prepared through a solgel approach. Various techniques were used to characterize the as-prepared products, including field emission scanning electron microscopy (FE-SEM), fie
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4b7b77d5733e0e04e2a79ddec4bd0f9d
https://doi.org/10.1109/ectc.2018.00366
https://doi.org/10.1109/ectc.2018.00366
Autor:
Joo-Wook Park, Kisu Joo, Jung Woo Hwang, Se Young Jeong, Yoon-Hyun Kim, Jin-Ho Yoon, Kyu Jae Lee, Myung Jin Yim
Publikováno v:
2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
In order to apply silver (Ag) epoxy composites to the FCBGA, we investigated how a variety condition of Ag epoxy composites such as curing temperature, Ag contents, and film thickness effects the electrical resistivity of shielding layer formed by Ag
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::61c8c485d615edd095857f8b689d17f4
https://doi.org/10.1109/ectc.2018.00276
https://doi.org/10.1109/ectc.2018.00276
Publikováno v:
2017 IEEE 67th Electronic Components and Technology Conference (ECTC).
A variety of shaped Ag particles was tested to obtain optimized electrical resistivity and mechanical reliability. We also studied the effect of the spray machine's parameters such as pressure, speed, and droplet size on uniformity of sprayed conduct
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f67ae178d33293c39aaef033c1cc269c
https://doi.org/10.1109/ectc.2017.327
https://doi.org/10.1109/ectc.2017.327
Autor:
Sung-Soon Choi, Kisu Joo, Boo Taek Lim, Tae-Ryong Kim, Se Young Jeong, Euijoon Yoon, Myung Jin Yim, Boung Ju Lee
Publikováno v:
2017 IEEE 67th Electronic Components and Technology Conference (ECTC).
In this study, we investigated the correlation between thermal conductivity and insulative shell thickness of SiO2 coated Ag (SCA) particles for the thermal filler material in the high performance underfill with focus on improved thermal conductivity
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7e5184975de26bc50733706405461124
https://doi.org/10.1109/ectc.2017.196
https://doi.org/10.1109/ectc.2017.196
Autor:
Myung Jin Yim1, Yi Li1, Kyoung-sik Moon1, Kyung Wook Paik2, Wong, C. P.1 cp.wong@mse.gatech.edu
Publikováno v:
Journal of Adhesion Science & Technology. 2008, Vol. 22 Issue 14, p1593-1630. 38p. 1 Black and White Photograph, 10 Diagrams, 4 Charts, 15 Graphs.
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 2:1059-1063
The large number of voids induced by the thermal effect from solder reflow process is one of the technical challenges for flip chip package techniques typically with no-flow underfills. The underfill voids could extensively reduce the life cycle in t
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::48982376afddddb2bf4afa5872960dcc
https://doi.org/10.1109/tcpmt.2012.2191617
https://doi.org/10.1109/tcpmt.2012.2191617
Publikováno v:
International Symposium on Microelectronics. 2010:000554-000558
The package on package (PoP) has become the preferred method for vertical stacking of logic processors and memory in mobile applications. The industry is constantly working toward reducing the total stack height, and current road maps point toward a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e0ac4c14d1c224c67c196b758c236012
https://doi.org/10.4071/isom-2010-wp1-paper4
https://doi.org/10.4071/isom-2010-wp1-paper4
Publikováno v:
IEEE Transactions on Components and Packaging Technologies. 32:754-758
Novel nonconductive adhesives/films (NCAs/NCFs) with carbon nanotubes (CNTs) for high-performance interconnects were developed. A small amount of CNTs inside NCAs/NCFs could increase the thermal conductivities and at the same time decrease the coeffi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4e87fa39faf189f73da7aaf1bfc90719
https://doi.org/10.1109/tcapt.2009.2014742
https://doi.org/10.1109/tcapt.2009.2014742
Publikováno v:
IEEE Transactions on Electronics Packaging Manufacturing. 32:241-247
In this paper, a novel anisotropic conductive film (ACF) flip chip bonding method using ultrasonic vibration for flip chip interconnection is demonstrated. The curing and bonding behaviors of ACFs by ultrasonic vibration were investigated using a 40-
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::09600e62a240796aed0fabac0bf7d59a
https://doi.org/10.1109/tepm.2009.2027894
https://doi.org/10.1109/tepm.2009.2027894
Publikováno v:
IEEE Transactions on Components and Packaging Technologies. 32:677-683
We have investigated the electrical properties of anisotropic conductive adhesive (ACA) joint using submicrometer-sized (~500 nm in diameter) silver (Ag) particle as conductive filler with the effect of π-conjugated self-assembled molecular wires. T
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8e5d57d729c41b5b53dc94bb1005ec76
https://doi.org/10.1109/tcapt.2009.2012720
https://doi.org/10.1109/tcapt.2009.2012720