Zobrazeno 1 - 10
of 87
pro vyhledávání: '"Myung Hoon Oh"'
Autor:
Sung-Hyun Park, Ozkan Gokcekaya, Ryosuke Ozasa, Ken Cho, Hiroyuki Y. Yasuda, Myung-Hoon Oh, Takayoshi Nakano
Publikováno v:
Crystals, Vol 13, Iss 12, p 1629 (2023)
To promote the use of γ-TiAl alloys in various domains, such as the aerospace industry, it is pivotal to investigate the unusual phase transformation from rapidly solidified and metastable γ-TiAl toward the equilibrium state. In this study, the mic
Externí odkaz:
https://doaj.org/article/a5c09e22183c46a59700b467b3220c7b
Publikováno v:
Mechanics Based Design of Structures and Machines. :1-20
Autor:
Sung-Hyun Park, Ryosuke Ozasa, Ozkan Gokcekaya, Ken Cho, Yasuda, Hiroyuki Y., Myung-Hoon Oh, Young-Won Kim, Takayoshi Nakano
Publikováno v:
Materials Transactions; 2024, Vol. 65 Issue 2, p199-204, 6p
Autor:
Sokho Kim, Myung-Hoon Oh, Bum-Seok Kim, Won-Il Kim, Ho-Seong Cho, Byoung-Yong Park, Chul Park, Gee-Wook Shin, Jungkee Kwon
Publikováno v:
Journal of Ginseng Research, Vol 39, Iss 4, Pp 365-370 (2015)
Background: The beneficial effects of ginsenoside species have been well demonstrated in a number of studies. However, the function of ginsenoside Ro (GRo), an oleanane-type saponin, has not been sufficiently investigated. Thus, the aim of the presen
Externí odkaz:
https://doaj.org/article/40d11896e35c48c8ac14b509d879ddc4
Publikováno v:
Journal of the Computational Structural Engineering Institute of Korea. 34:287-292
Publikováno v:
Journal of the Computational Structural Engineering Institute of Korea. 32:241-247
Publikováno v:
Korean Journal of Materials Research. 29:258-263
Development and Evaluation of High-Density Multi-GPU Sub-System Using PCI Express Expansion Hardware
Publikováno v:
2020 IEEE International Conference on Consumer Electronics - Asia (ICCE-Asia).
In this paper, we develop and evaluate a high-density multi-GPU hardware sub-system for high performance computing and deep learning. The high-density multi-GPU hardware is implemented as an out-of-box hardware by extending PCI Express system bus via
Publikováno v:
Metals and Materials International. 24:626-632
Although the welding zone of direct bonding between a TiAl alloy and SCM440 can be obtained by friction welding, martensitic transformation and the formation of intermetallic compounds (IMCs) and cracks result in a lower tensile strength of the joint
Autor:
Myung-Hoon Oh, Dong Hun Kim
Publikováno v:
Journal of Institute of Control, Robotics and Systems. 23:920-926