Výsledky vyhledávání

Electroless Ni Plating to Compensate for Bump Height Variation in Cu–Cu 3-D Packaging

Autor: Myo Paing, D.M. Fernandez, Yen Chen Yeo, Jaesik Lee, S. Gao

Publikováno v: IEEE Transactions on Components, Packaging and Manufacturing Technology. 2:964-970

The feasibility of electroless Ni plating to compensate the Cu bump height variation in Cu-Cu 3-D packaging was investigated. After fabricating Cu pillar bump and Cu micro-stud structure on the top and bottom chips, respectively, Cu-Cu thermocompress

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::6fc99f37ec70ef16aa53c76a8c3b9734
https://doi.org/10.1109/tcpmt.2011.2177269

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Novel chip stacking process for 3D integration

Autor: S. Gao, Jaesik Lee, Myo Paing, D.M. Fernandez, Yen Chen Yeo

Publikováno v: 2011 IEEE 61st Electronic Components and Technology Conference (ECTC).

A chip stacking process for three dimensional integration is reported. This process consists of solderless thermo-compression bonding and chemical plating to connect non-contacted Cu interconnection. The Cu bumps and micro stud structures are fabrica

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::80450cb015db9fbbcca8099b23c532f3
https://doi.org/10.1109/ectc.2011.5898782

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Embedding of 15um thin chip and passives in thin flexible substrate

Autor: Xiaowu Zhang, Justin See Toh Wai Hong, Myo Paing, V. N. Sekhar, Serene Thew, Soon Wee Ho, Justin Wee Kim Soon, S. C. Chong, Ying Ying Lim, Ranjan Rajoo, Fernandez Daniel Moses

Publikováno v: 2010 12th Electronics Packaging Technology Conference.

This study demonstrates the embedding of ultra-thin 15um active chips and passives in flexible printed circuit substrates. We describe the process of fabricating the embedded-actives-and-passives modules, starting with the fabrication of the chips an

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::66b097524edfa23a0ea0952c70a84fde
https://doi.org/10.1109/eptc.2010.5702689

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Newly developed integration method for biomedical implants using flexible polymer cable

Autor: Myo Paing, Yu Aibin, Yu Daquan, Cheng Ming-Yuan, Li Shiah Lim

Publikováno v: 2010 12th Electronics Packaging Technology Conference.

This paper presented an integration method for biomedical implants by using solder bonding and highly flexible polyimide (PI) cable. The proposed integration method can overcame the problems in flexible cable assembly before. It can achieve a small f

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::a07edaebf07acc2a38ce1bd499855e5a
https://doi.org/10.1109/eptc.2010.5702669

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