Zobrazeno 1 - 10
of 18
pro vyhledávání: '"Myeong-Hyeok Jeong"'
Publikováno v:
Journal of Electronic Materials. 41:791-799
The effects of surface finishes on the in situ interfacial reaction characteristics of ball grid array (BGA) Sn-3.0Ag-0.5Cu lead-free solder bumps were investigated under annealing and electromigration (EM) test conditions of 130°C to 175°C with 5.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1d97be515a5c7c34bd8bb8fc025de0cc
https://doi.org/10.1007/s11664-011-1888-2
https://doi.org/10.1007/s11664-011-1888-2
Publikováno v:
Microelectronic Engineering. 89:42-45
Effects of HF & H"2SO"4 pretreatment conditions on the interfacial bonding strength of Cu-Cu direct bonds were systematically investigated. The evaluated interfacial adhesion energies for 3@mm-thick Cu bonding layers were 0.58, 0.46, and 4.90J/m^2 fo
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::85a6a7e1d3d6be0308a2b0b562e88366
https://doi.org/10.1016/j.mee.2011.06.002
https://doi.org/10.1016/j.mee.2011.06.002
Autor:
Jae-Won Kim, Young-Bae Park, Myeong-Hyeok Jeong, Hoo-Jeong Lee, Byung-Hyun Kwak, Byunghoon Lee
Publikováno v:
Microelectronic Engineering. 89:65-69
An investigation of the effects of thermal annealing on the growth of intermetallic compounds (IMCs) and the shear strength of Cu/Sn/Cu pillar bump structures is presented. The Cu"6Sn"5 phase formed at the Cu/Sn interface right after bonding and grew
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fd155cac9eec069116943473d8672a0c
https://doi.org/10.1016/j.mee.2011.01.020
https://doi.org/10.1016/j.mee.2011.01.020
Publikováno v:
Microelectronic Engineering. 89:50-54
Thermal annealing and electromigration (EM) tests were performed at 125-175^oC with 2.2x10^4A/cm^2 conditions in order to investigate the growth kinetics of intermetallic compound (IMC) in Cu/thin Sn/bump. Cu"3Sn was formed and grown at the Cu pillar
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::469276aef31a67f5cec112461ca10c04
https://doi.org/10.1016/j.mee.2011.04.025
https://doi.org/10.1016/j.mee.2011.04.025
Autor:
Myeong-Hyeok Jeong, Young-Bae Park
Publikováno v:
Current Applied Physics. 11:S124-S127
Annealing and current stressing were performed at 125∼160 °C with 5 × 10 4 A/cm 2 conditions in order to investigate the interfacial reaction and growth kinetics of the Intermetallic Compound (IMC) in Au stud/Sn bumps. AuSn, AuSn 2 , and AuSn 4 p
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ae6617db0ef66ed1436449a1c08240b3
https://doi.org/10.1016/j.cap.2011.01.053
https://doi.org/10.1016/j.cap.2011.01.053
Autor:
Jaedong Kim, Young-Bae Park, Byoung-Joon Kim, Young-Chang Joo, Gi-Tae Lim, Kiwook Lee, Myeong-Hyeok Jeong
Publikováno v:
Journal of Electronic Materials. 39:2368-2374
Thermal annealing and electromigration (EM) tests were performed with Cu pillar/Sn bumps to understand the growth mechanism of intermetallic compounds (IMCs). Annealing tests were carried out at both 100°C and 150°C. At 150°C, EM tests were perfor
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::dcad2d91b3636150c7c0c5c3c4c4027c
https://doi.org/10.1007/s11664-010-1345-7
https://doi.org/10.1007/s11664-010-1345-7
Publikováno v:
Microelectronic Engineering. 89:55-57
The effect of electroless nickel immersion gold (ENIG) and organic solderability preservative (OSP) surface finishes on the shear strength of Sn-3.0Ag-0.5Cu solder joints were investigated under the various loading speeds of 0.2-1000mm/s. Maximum she
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e3bfa8072a90988bed59f0103d9b98c4
https://doi.org/10.1016/j.mee.2011.03.148
https://doi.org/10.1016/j.mee.2011.03.148
Publikováno v:
2012 IEEE 62nd Electronic Components and Technology Conference.
The effect of interfacial microstructures on the bonding strength of Sn-1.2Ag-0.7Cu-0.4In Pb-free solder bumps with respect to the loading speed, annealing time, and surface finish was investigated. The shear force increased and the ductility decreas
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b25d83040bb95f25b97db331e01c9336
https://doi.org/10.1109/ectc.2012.6248999
https://doi.org/10.1109/ectc.2012.6248999
Publikováno v:
2011 IEEE 13th Electronics Packaging Technology Conference.
Interfacial microstructure and mechanical reliability of Cu pillar/Sn-3.5Ag microbumps during annealing conditions were systematically and quantitatively evaluated. The IMC growth followed a linear relationship with the square root of the annealing t
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a6a87c499f29b6da6949cdef63f010aa
https://doi.org/10.1109/eptc.2011.6184384
https://doi.org/10.1109/eptc.2011.6184384
Publikováno v:
18th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA).
The effects of electroless nickel immersion gold (ENIG) and immersion Sn pad finishes on the shear strength of Sn-3.0Ag-0.5Cu solder joints were investigated under the various loading speeds of 0.2∼1,000 mm/s. shear strength increased with increasi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e967a0aa500a9618320222fe35b6a44d
https://doi.org/10.1109/ipfa.2011.5992741
https://doi.org/10.1109/ipfa.2011.5992741