Zobrazeno 1 - 3
of 3
pro vyhledávání: '"Myeong Soo Yeo"'
Autor:
Moon Soo Lee, Min Kim, Sungwon Jung, A-ram Kang, Myeong-soo Yeo, Shinyoung Chung, Eun-cheol Lee
Publikováno v:
IMAPSource Proceedings. 2022
An enhanced Cu pillar bump shear test (BST) method has been developed to quantify wafer level back-end-of-line (BEOL) mechanical integrity and assess the risk of white bump failure. First, three different types of failure mode in the BST and the one
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d26c55fa41cbf094f812997298dffa85
https://doi.org/10.4071/001c.74599
https://doi.org/10.4071/001c.74599
Autor:
Seo Hyun Kwon, Myeong Soo Yeo, Hwa-Sung Rhee, Sangwoo Pae, Moon Soo Lee, Min Suk Jeong, Min Kim, Inhak Baick
Publikováno v:
IEEE Transactions on Device and Materials Reliability. 20:286-292
Molded underfill process provides many benefits for higher productivity and lower cost over the conventional capillary underfill process. However, the void defects in a molded underfill process could cause pop-corning effect and solder extrusion duri
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::41842b58147efa1412dec5393228ae27
https://doi.org/10.1109/tdmr.2020.2985209
https://doi.org/10.1109/tdmr.2020.2985209
Autor:
Min Kim, Moon Soo Lee, Myeong Soo Yeo, Inhak Baick, Hwa-Sung Rhee, Seo Hyun Kwon, Eun-Cheol Lee
Publikováno v:
IRPS
A chip to package interaction risk assessment platform has been developed using finite element analysis, meta-modeling and genetic algorithm optimization method to tackle increasing variations in package specifications. The results show that the meta
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::254622a91b24ece6ea464cc79b64acbd
https://doi.org/10.1109/irps46558.2021.9405133
https://doi.org/10.1109/irps46558.2021.9405133