Zobrazeno 1 - 10
of 11
pro vyhledávání: '"Muthappan Asokan"'
Autor:
Goutham Issac Ashok Kumar, Alexander Lambert, Joshua Caperton, Muthappan Asokan, William Yi, Oliver Chyan
Publikováno v:
Corrosion and Materials Degradation, Vol 2, Iss 3, Pp 447-460 (2021)
The introduction of copper as wire bonding material brings about a new challenge of aluminum bond pad bimetallic corrosion at the copper/aluminum galvanic interface. Aluminum is well known to undergo pitting corrosion under halide-contaminated enviro
Externí odkaz:
https://doaj.org/article/63053e58c9f843bfb1e9af0e6ea42c5d
Autor:
Oliver Chyan, Joshua Caperton, Goutham Issac Ashok Kumar, Alexander Lambert, Muthappan Asokan, William Yi
Publikováno v:
Corrosion and Materials Degradation
Volume 2
Issue 3
Pages 23-460
Corrosion and Materials Degradation, Vol 2, Iss 23, Pp 447-460 (2021)
Volume 2
Issue 3
Pages 23-460
Corrosion and Materials Degradation, Vol 2, Iss 23, Pp 447-460 (2021)
The introduction of copper as wire bonding material brings about a new challenge of aluminum bond pad bimetallic corrosion at the copper/aluminum galvanic interface. Aluminum is well known to undergo pitting corrosion under halide-contaminated enviro
Publikováno v:
International Symposium on Microelectronics. 2018:000655-000659
Copper has rapidly replaced gold as the preferred wire bonding material in microelectronic packaging due to its lower cost and many performance advantages. However, halides induced corrosion-related failures need to be carefully controlled to ensure
Publikováno v:
Journal of Industrial and Engineering Chemistry. 51:44-48
Subtractive copper etching is a central process in fabricating advanced printed circuit boards, where ever-shrinking features demand precise control of etch rate and etch factor. Copper etching baths, using cupric chloride, involve complex chemical e
Autor:
Muthappan Asokan, John Alptekin, Nick Ross, Ashish Salunke, Joshua Caperton, Goutham Issac Ashok Kumar, Oliver Chyan
Publikováno v:
Microelectronics Reliability. 113:113917
Microelectronic reliability requirements are tightening to a standard of near zero ppb defects due to the evolution of self-driving cars and wearable electronics. The successful transition from gold (Au) to copper (Cu) in wire-bonding introduces corr
Autor:
Kyle Yu, Karthikeyan S. M. Pillai, Muthappan Asokan, Oliver Chyan, Sirish Rimal, Praveen Reddy Nalla, Kanwal Jit Singh, Satyarth Suri, Simon Koskey
Publikováno v:
Electrochimica Acta. 210:512-519
The continued miniaturization of the integrated circuit, leading to minute dimensions ( 12) at Cu/Ru interface, caused by enhanced oxygen reduction reaction on Ru, is proposed to generate more NH 3 for sustaining fast Cu corrosion. Effects of differe
Autor:
Shawn O'Connor, Luu Nguyen, Oliver Chyan, Zach Thompson, Mahmud Chowdhury, Josh Caperton, Muthappan Asokan
Publikováno v:
2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
In this paper, we report an efficient corrosion screening method using micro-pattern test structures for analyzing Al bond pad corrosion in Cu wire bonded assembly. The new insights of the corrosion mechanism on Al bond pad in chloride environment he
Autor:
L. Nguyen, S. Berhe, Nick Ross, S. O. Connor, A. Lambert, M. Chowdhury, Oliver Chyan, Muthappan Asokan
Publikováno v:
2017 IEEE 67th Electronic Components and Technology Conference (ECTC).
Heavy corrosion on Aluminum (Al) bond pad, with a "mud-crack" appearance, in a Copper (Cu) wire-bonded assembly can be a critical failure mode, especially under harsh conditions such as in automotive environments. Such corrosion can be associated wit
Autor:
John Alptekin, Ashish Shivaji Salunke, Muthappan Asokan, Goutham Issac, Joshua Caperton, Oliver Chyan
Publikováno v:
ECS Meeting Abstracts. :1015-1015
Due to the constant miniaturization of microelectronics, the aim of the semiconductor industry has been to increase the packaging density of devices. Wire bonds form the primary interconnects between the integrated circuit chip and the metal lead fra
Publikováno v:
ECS Meeting Abstracts. :978-978
Microelectronics are used in virtually all electronic equipment’s nowadays ranging from medical instruments, automobiles, computers, cell phones and home appliances. Wirebonding process which connects the chip to the lead frame in IC packaging play