Zobrazeno 1 - 10
of 25
pro vyhledávání: '"Murat PARLAK"'
Autor:
Vahid Ebrahimpour Ahmadi, Mohammad Hadi Khaksaran, Ahmet Muhtar Apak, Alper Apak, Murat Parlak, Umur Tastan, Ismet Inonu Kaya, Abdolali Khalili Sadaghiani, Ali Koşar
Publikováno v:
Carbon Trends, Vol 8, Iss , Pp 100171- (2022)
Phase change heat transfer via pool boiling is an effective and low-cost method for applications such as electronics cooling and noticeably depends on bubble dynamics behavior. Porous copper surfaces provide a larger heat transfer area and more nucle
Externí odkaz:
https://doaj.org/article/52c7e90c6af2489480a3f84b644cfc0c
Autor:
Murat PARLAK
Publikováno v:
Social Sciences Studies Journal. 109:6228-6236
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7376aab35290db9cd81e4f5bc3a2a7bf
https://doi.org/10.29228/sssj.68723
https://doi.org/10.29228/sssj.68723
Publikováno v:
2022 28th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9c34d9a205083eef75e64c98bbf5056a
https://doi.org/10.1109/therminic57263.2022.9950694
https://doi.org/10.1109/therminic57263.2022.9950694
Autor:
Ayşenur Ateş, Süleyman Çelik, Vedat Yağcı, Muhammed Çağlar Malyemez, Murat Parlak, Abdolali K Sadaghiani, Ali Koşar
Publikováno v:
Applied Thermal Engineering. 223:120045
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1a08cb263110b06a25c0e8d6689b9635
https://doi.org/10.1016/j.applthermaleng.2023.120045
https://doi.org/10.1016/j.applthermaleng.2023.120045
Publikováno v:
2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f206662e437a50826ed9896eddb7f2fc
https://doi.org/10.1109/itherm54085.2022.9899552
https://doi.org/10.1109/itherm54085.2022.9899552
Autor:
Murat PARLAK
Publikováno v:
Route Educational and Social Science Journal.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3da2987cff292db16e417415b9c0a9ed
https://doi.org/10.17121/ressjournal.3202
https://doi.org/10.17121/ressjournal.3202
Autor:
Ayşenur Ateş, Behnam Parizad Benam, Vedat Yağcı, Muhammed Çağlar Malyemez, Murat Parlak, Abdolali K Sadaghiani, Ali Koşar
Publikováno v:
Applied Thermal Engineering. 212:118648
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::657dfe20a4cdffbef94c760ab220fb07
https://doi.org/10.1016/j.applthermaleng.2022.118648
https://doi.org/10.1016/j.applthermaleng.2022.118648
Autor:
Nilsun DEMİR, Burak ÖTERLER, Haşim SÖMEK, Tuğba ONGUN SEVİNDİK, Elif SOYLU, Yakup KARAASLAN, Tolga ÇETİN, Abuzer ÇELEKLİ, Tolga COŞKUN, Cüneyt Nadir SOLAK, Faruk MARAŞLIOĞLU, Murat PARLAK, Hacer Merve KOCA, Doğancan MANAVOĞLU
Publikováno v:
Volume: 5, Issue: 2 204-229
Turkish Journal of Water Science and Management
Turkish Journal of Water Science and Management
Turkish lakes have different morphometric and hydrological features as a result of different climates and noticeable altitude differences in Turkey that are necessary conditions to occur different habitats for algal diversity. The total number of alg
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::26dea76d097b3c222d28934a65104e8c
https://dergipark.org.tr/tr/pub/tjwsm/issue/64101/835111
https://dergipark.org.tr/tr/pub/tjwsm/issue/64101/835111
Publikováno v:
2020 26th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC).
Heat pipes are mainly used to carry heat from a compact region to a broad space to keep the hot spot in an allowable temperature range with high reliability via passive cooling. In military electronics, due to high-speed processors, dissipated heat c
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fe915bac0d4b8ac4890cf7825d36f75e
https://doi.org/10.1109/therminic49743.2020.9420534
https://doi.org/10.1109/therminic49743.2020.9420534
Publikováno v:
2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
© 2020 IEEE.As electronic technology develops continuously, space and power allocated for cooling demands increase with time. Therefore, it becomes necessary to develop effective approaches to decrease the cooling power spent and allocated space to
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::bd4776fe89507f2a8fbd79cfaa13a5e9
https://doi.org/10.1109/itherm45881.2020.9190297
https://doi.org/10.1109/itherm45881.2020.9190297