Zobrazeno 1 - 1
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pro vyhledávání: '"Munmo Jeong"'
Publikováno v:
International Symposium for Testing and Failure Analysis.
This paper describes the failure analysis methods used to characterize micro cracks that resulted in laser vias of printed circuit boards (PCBs) through case studies of destructive failure analysis. Defects such as cracks in laser vias of PCBs can ca
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7d4e93c277c44bc47108d2906f4b888c
https://doi.org/10.31399/asm.cp.istfa2017p0059
https://doi.org/10.31399/asm.cp.istfa2017p0059
