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pro vyhledávání: '"Multiphotonenlithographie"'
Autor:
Xu, Yilin
Photonic integrated circuits (PIC) become increasingly important for numerous applications. Mass production of PIC has become widely available, but large-volume low-cost photonic packaging still represents a challenge. Additive micro-fabrication of f
Externí odkaz:
https://library.oapen.org/handle/20.500.12657/62898