Zobrazeno 1 - 10
of 245
pro vyhledávání: '"Muhannad S. Bakir"'
Autor:
Sreejith Kochupurackal Rajan, Bharath Ramakrishnan, Husam Alissa, Washington Kim, Christian Belady, Muhannad S Bakir
Publikováno v:
IEEE Access, Vol 10, Pp 59259-59269 (2022)
The stagnation of Dennard scaling along with the move towards heterogeneous 2.5D and 3D ICs is increasing the thermal design power (TDP) envelopes of general-purpose CPUs. With conventional cooling approaches such as air-cooling and cold plates, it i
Externí odkaz:
https://doaj.org/article/de8f10f5c0de4700aa5359b347744449
Autor:
Ankit Kaul, Yandong Luo, Xiaochen Peng, Madison Manley, Yuan-Chun Luo, Shimeng Yu, Muhannad S. Bakir
Publikováno v:
IEEE Transactions on Electron Devices. 70:485-492
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0dea8dcd2410bc0a3c4e79545399769e
https://doi.org/10.1109/ted.2022.3231570
https://doi.org/10.1109/ted.2022.3231570
Autor:
Ting Zheng, Muhannad S. Bakir
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 12:2002-2012
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::827749fa651f441bb813640fd8c0a99f
https://doi.org/10.1109/tcpmt.2022.3223966
https://doi.org/10.1109/tcpmt.2022.3223966
Autor:
Md Obaidul Hossen, Ankit Kaul, Eriko Nurvitadhi, Mondira Deb Pant, Ravi Gutala, Aravind Dasu, Muhannad S. Bakir
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 12:1824-1831
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e8d814144c6164ccb809bd63705888f0
https://doi.org/10.1109/tcpmt.2022.3223687
https://doi.org/10.1109/tcpmt.2022.3223687
Autor:
Muhannad S. Bakir
Publikováno v:
2023 International VLSI Symposium on Technology, Systems and Applications (VLSI-TSA/VLSI-DAT).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::60af618ef67a4385bb3299e0f2920135
https://doi.org/10.1109/vlsi-tsa/vlsi-dat57221.2023.10134195
https://doi.org/10.1109/vlsi-tsa/vlsi-dat57221.2023.10134195
Publikováno v:
IEEE Photonics Technology Letters. 34:1023-1025
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f26a137dfd764d2cdb03f494cfbb287a
https://doi.org/10.1109/lpt.2022.3199457
https://doi.org/10.1109/lpt.2022.3199457
Publikováno v:
Embedded and Fan‐Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces. :261-287
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::eebda3bb24486b61707a35949c5b9712
https://doi.org/10.1002/9781119793908.ch11
https://doi.org/10.1002/9781119793908.ch11
Autor:
Ting Zheng, Muhannad S. Bakir, Sreejith Kochupurackal Rajan, Jonathan R. Brescia, Joe L. Gonzalez
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 11:2069-2076
This paper presents a novel die-level, rePlaceable INtegrated CHiplet (PINCH) assembly using a socketed platform. To enable the replaceability of this tightly-integrated system, the appropriate set of enabling technologies is required. To this end, t
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ba42133cb68055f2942685a03b45ae6a
https://doi.org/10.1109/tcpmt.2021.3118334
https://doi.org/10.1109/tcpmt.2021.3118334
Autor:
Muhannad S. Bakir, Ming-Jui Li
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 11:2242-2245
We propose a 3D heterogeneous integration technology called 3D Integrated Chiplet-Encapsulation (3D ICE). The proposed 3D ICE architecture encapsulates chiplets into a reconstituted tier using low-temperature (100 °C) ICP-PECVD SiO2 deposition. The
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::73b9b2947b170cadd0659f1754037da5
https://doi.org/10.1109/tcpmt.2021.3125338
https://doi.org/10.1109/tcpmt.2021.3125338
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 11:2061-2068
This paper presents a novel substrate-agnostic self-alignment technology with submicron alignment accuracy targeted for heterogeneous integrated systems. This self-alignment technology, referred to as PSAS-to-PSAS self-alignment, incorporates positiv
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::07c9ee7e3b307dc524a21772a67f9cf3
https://doi.org/10.1109/tcpmt.2021.3109913
https://doi.org/10.1109/tcpmt.2021.3109913