Zobrazeno 1 - 10
of 304
pro vyhledávání: '"Muhannad Bakir"'
Publikováno v:
IEEE Journal of the Electron Devices Society, Vol 12, Pp 426-432 (2024)
For the autonomous driving application, data movement has increased rapidly between a CMOS Image sensor (CIS) and the processor due to increase in image resolution. Advanced packaging techniques like 2.5D/3D integration have been proposed to reduce t
Externí odkaz:
https://doaj.org/article/f51cdfe358af48d99f3db361a0b14654
Autor:
Bryce Chung, Muneeb Zia, Kyle A Thomas, Jonathan A Michaels, Amanda Jacob, Andrea Pack, Matthew J Williams, Kailash Nagapudi, Lay Heng Teng, Eduardo Arrambide, Logan Ouellette, Nicole Oey, Rhuna Gibbs, Philip Anschutz, Jiaao Lu, Yu Wu, Mehrdad Kashefi, Tomomichi Oya, Rhonda Kersten, Alice C Mosberger, Sean O'Connell, Runming Wang, Hugo Marques, Ana Rita Mendes, Constanze Lenschow, Gayathri Kondakath, Jeong Jun Kim, William Olson, Kiara N Quinn, Pierce Perkins, Graziana Gatto, Ayesha Thanawalla, Susan Coltman, Taegyo Kim, Trevor Smith, Ben Binder-Markey, Martin Zaback, Christopher K Thompson, Simon Giszter, Abigail Person, Martyn Goulding, Eiman Azim, Nitish Thakor, Daniel O'Connor, Barry Trimmer, Susana Q Lima, Megan R Carey, Chethan Pandarinath, Rui M Costa, J Andrew Pruszynski, Muhannad Bakir, Samuel J Sober
Publikováno v:
eLife, Vol 12 (2023)
Neurons coordinate their activity to produce an astonishing variety of motor behaviors. Our present understanding of motor control has grown rapidly thanks to new methods for recording and analyzing populations of many individual neurons over time. I
Externí odkaz:
https://doaj.org/article/e563cae1ff0846e3ac2f96ce86dc95ca
Publikováno v:
IEEE Journal on Emerging and Selected Topics in Circuits and Systems. 12:445-457
Publikováno v:
2023 7th IEEE Electron Devices Technology & Manufacturing Conference (EDTM).
Publikováno v:
2021 IEEE International Electron Devices Meeting (IEDM).
Autor:
Avram Bar-Cohen, Jeffrey C Suhling, Andrew A O Tay, Pengli Zhu, Gang Li, C P Wong, Dae Young Jung, Stephen R Cain, William Chen, Bahgat G Sammakia, Muhannad Bakir, Suresh K Sitaraman, Kuan-Neng Chen, Chuan Seng Tan
Publikováno v:
Encyclopedia of Packaging Materials, Processes, and Mechanics ISBN: 9789811201141
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b53416f212b4062083bb51c5cc80b2ff
https://doi.org/10.1142/11303-vol3
https://doi.org/10.1142/11303-vol3
Publikováno v:
Novel Advances in Microsystems Technologies and Their Applications ISBN: 9781315216188
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::3f6662332429d8138b42b59fab6f5a1c
https://doi.org/10.1201/b15283-3
https://doi.org/10.1201/b15283-3
Autor:
Nimbalkar, Pratik1 (AUTHOR) pragna@gatech.edu, Bhaskar, Pragna1 (AUTHOR) kmohan@ece.gatech.edu, Kathaperumal, Mohanalingam1 (AUTHOR) rtummala@ece.gatech.edu, Swaminathan, Madhavan2 (AUTHOR) mvs7249@psu.edu, Tummala, Rao R.1 (AUTHOR)
Publikováno v:
Polymers (20734360). Oct2023, Vol. 15 Issue 19, p3895. 19p.