Zobrazeno 1 - 10
of 23
pro vyhledávání: '"Muhammad Nubli Zulkifli"'
Autor:
Nor Hidayah Abdul Kahar, Nurul Hanis Azhan, Ibrahim Alhamrouni, Muhammad Nubli Zulkifli, Tole Sutikno, Awang Jusoh
Publikováno v:
Bulletin of Electrical Engineering and Informatics. 12:1993-2004
This paper describes the design of a solar photovoltaic (PV) system using simulation of PVsyst software. This work involves the simulation of bifacial and mono-facial PV solar in a large-scale solar system. For a bifacial system, the yearly total ene
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::25afef30cb711ebb6bb04401293c0b21
https://doi.org/10.11591/eei.v12i4.5072
https://doi.org/10.11591/eei.v12i4.5072
Publikováno v:
IEEE Journal of Photovoltaics. 12:1418-1427
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::dadb094c33e089456988639ffefcf54f
https://doi.org/10.1109/jphotov.2022.3209021
https://doi.org/10.1109/jphotov.2022.3209021
Publikováno v:
Materials Science Forum. 1055:27-35
This paper aims to review the methodologies used to conduct microstructure evaluation of the photovoltaic (PV) interconnection. This analysis is important to identify the microstructural properties of the interconnection for failure analysis purposes
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d9cd590e72b91c8e617ada9364a6c64f
https://doi.org/10.4028/p-b5metv
https://doi.org/10.4028/p-b5metv
Autor:
Hassan Basher, Muhammad Nubli Zulkifli, Mohd Khairil Rahmat, Muhammad Ghazali Abdul Rahman, Azman Jalar, Michael Daenen
Publikováno v:
Solar Energy. 228:516-522
This paper aims to study the bondability of ultrasonic Aluminum, Al bonds on Mo and MoSe2 layers of back-contact metal of copper indium gallium (de)selenide (CIGS) thin film photovoltaic (TFPV) solar panel. The bondability of ultrasonic Al bonds were
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::799380577a4f006d3e6926f53104fe3c
https://doi.org/10.1016/j.solener.2021.09.082
https://doi.org/10.1016/j.solener.2021.09.082
Publikováno v:
IEEE Journal of Photovoltaics. 11:345-353
This article aims to investigate the optimal ultrasonic bonding parameter namely bonding pressure, bonding energy, and bonding amplitude that can minimize the contact resistance ( Rc ), maximize the peel strength, and identify the possible failure mo
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::18766434c6b0a74e9b09b04724676945
https://doi.org/10.1109/jphotov.2020.3047295
https://doi.org/10.1109/jphotov.2020.3047295
Autor:
Rabiah Al Adawiyah Ab Rahim, Muhammad Nubli Zulkifli, Azman Jalar, Atiqah Mohd Afdzaluddin, Siow Shyong Kim
Publikováno v:
Sains Malaysiana. 49:3045-3054
This study aims to evaluate the effect of copper (Cu) substrate surface roughness on the intermetallic compound (IMC) growth and interfacial reaction of SAC305 lead-free solder joint after undergone an aging process. Aging process was conducted using
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::95556cc8308aa2f2150d09c31cadce4d
https://doi.org/10.17576/jsm-2020-4912-16
https://doi.org/10.17576/jsm-2020-4912-16
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 9:763-769
The evaluation of the manufacturability, bondability, and reliability performances of the granular capillary is required to produce high-quality wire bonds. In this paper, two different types of wire bonding capillaries, namely, granular and conventi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8c37c8b2ca89946b5c46305811d51c1c
https://doi.org/10.1109/tcpmt.2019.2899401
https://doi.org/10.1109/tcpmt.2019.2899401
Publikováno v:
Microelectronics International. 36:62-67
Purpose This paper aims to analyze the effect of surface roughness and hardness of leadframe on the bondability of gold (Au) wedge bond using in situ inspection of laser interferometer and its relationship with the deformation and wire pull strength.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8603b6b584a8a28318d474caf57fd9ae
https://doi.org/10.1108/mi-08-2018-0053
https://doi.org/10.1108/mi-08-2018-0053
Publikováno v:
Journal of Electronic Materials. 48:2826-2839
A characterization of mechanical and micromechanical properties of SAC305 solder wire under varied strain rates and temperatures was performed using tensile and nanoindentation tests. The evolution of SAC305 lead-free solder wire grains was compared
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::35eb25a0f12ef6912a8fc34f4026195c
https://doi.org/10.1007/s11664-019-06985-2
https://doi.org/10.1007/s11664-019-06985-2
Autor:
Azleena Kamarul Bahrain, Anis Nurashikin Nordin, Muhammad Nubli Zulkifli, Mohd Azraie Mohd Azmi, Suhaili Sabdin, Fatihatul Zuriati Makmon, Azman Abd Aziz, Nurul Azzurin Badruzzaman
Publikováno v:
Materials Today: Proceedings. 16:1661-1667
Currently, new fabrication methods for rapid prototyping of microfluidic devices has bring attention among researchers from various fields. The main reason is the use of lithographic equipment in standard fabrication method for master fabrication req
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::afa3da9659eecb5339f16884fe34944b
https://doi.org/10.1016/j.matpr.2019.06.032
https://doi.org/10.1016/j.matpr.2019.06.032