Výsledky vyhledávání - "Mu-Ping Hsu"

Scheme for Multi-Chiplet Integration With Low Thermal Budget by Asymmetric Cu-Cu Bonding With Au Passivation Bonding Structure

Autor: Zhong-Jie Hong, Ming-Wei Weng, Chih-Han Chen, Mu-Ping Hsu, Han-Wen Hu, Tai-Yu Lin, Ying-Chan Hung, Kuan-Neng Chen

Publikováno v: IEEE Electron Device Letters. 44:492-495

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::b3db55874e4728f36da99a76a917edac
https://doi.org/10.1109/led.2023.3239011

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Development of Low-Temperature Bonding Platform Using Ultra-Thin Area Selective Deposition for Heterogeneous Integration

Autor: Mu-Ping Hsu, Chi-Yu Chen, Hsin-Chi Chang, Zhong-Jie Hong, Ming-Wei Weng, Kuan-Neng Chen

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::7cf3e4d016b727324f777914852354f8
https://doi.org/10.2139/ssrn.4425363

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