Zobrazeno 1 - 10
of 69
pro vyhledávání: '"Mu Hee Cho"'
Autor:
Mu Hee Cho, Tae Young Ma
Publikováno v:
Journal of the Korean Institute of Electrical and Electronic Material Engineers. 28:433-438
Zinc tin oxide transparent thin film transistors (ZTO TTFTs) were fabricated by using Si wafers as gate electrodes. Indium (In), aluminum (Al), indium tin oxide (ITO), silver (Ag), and gold (Au) were employed for source and drain electrodes, and the
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5e2b8a62a74c035e4bacb87757d4b88b
https://doi.org/10.4313/jkem.2015.28.7.433
https://doi.org/10.4313/jkem.2015.28.7.433
Autor:
Nga T. H. Nguyen, Ikechi Augustine Ukaegbu, Tae-Woo Lee, M. Rakib Uddin, Mu Hee Cho, Jamshid Sangirov, Hyo-Hoon Park
Publikováno v:
Optical and Quantum Electronics. 49
This paper presents thermal analysis on crosstalk and performance of optoelectronic transmitter modules and also demonstrates the thermal analysis for efficient heat dissipation for the transmitter modules. The thermal crosstalk model for analysis is
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b2b6d03d4deacc59089759991f02fbd5
https://doi.org/10.1007/s11082-017-1110-8
https://doi.org/10.1007/s11082-017-1110-8
Autor:
Tae-Woo Lee, Mu Hee Cho, Ikechi Augustine Ukaegbu, Jamshid Sangirov, Hyo-Hoon Park, M. Rakib Uddin, Nga T. H. Nguyen
Publikováno v:
Optical and Quantum Electronics. 49
This work presents a full-duplex and multifunction bidirectional transceiver for optical interconnect application. The transceiver utilizes a common limiting amplifier/gain stage, thus reducing total chip area and total power consumption. While provi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::17f9ab164c9e8ff5dca8b058b61c6525
https://doi.org/10.1007/s11082-017-1078-4
https://doi.org/10.1007/s11082-017-1078-4
Autor:
Jamshid Sangirov, Hyo-Hoon Park, Gwan-Chong Joo, Nguyen T. H. Nga, Mu-Hee Cho, Byueng-Su Yoo, Tae-Woo Lee, Ikechi Augustine Ukaegbu
Publikováno v:
IEEE Photonics Technology Letters. 26:609-612
A 10 Gbps/ch full-duplex (simultaneous bidirectional) optical link utilizing two optical subassembly (OSA) transceiver (TRx) modules and two wavelengths, 850 and 1060 nm, for sending and receiving optical signals through a single fiber channel in a f
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c6598d4d11c42b1237e6de2bbc45c306
https://doi.org/10.1109/lpt.2014.2301742
https://doi.org/10.1109/lpt.2014.2301742
Autor:
Nga T. H. Nguyen, Ikechi Augustine Ukaegbu, Hyo-Hoon Park, Mu Hee Cho, Tae-Woo Lee, Jamshid Sangirov
Publikováno v:
Microwave and Optical Technology Letters. 55:2484-2487
A transimpedance amplifier (TIA) has been designed and implemented for short-reach optical interconnect applications. The TIA, which is based on the regulated cascode technique, is implemented with a bandwidth enhancement technique, where capacitive
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5470917cca458f4fe8f03306781abf1a
https://doi.org/10.1002/mop.27886
https://doi.org/10.1002/mop.27886
Publikováno v:
Journal of the Optical Society of Korea. 17:44-49
2with power consumption of 16.9 mW at 1.3 V. The measured input-referred noise of optical TIA-Rx is 20 pA/√Hz with a 3-dB bandwidth of 6.9 GHz. The proposed TIA-Rx achieved a high gain-bandwidth product per DC power figure of merit of 408 GHzΩ /m
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::43eef24e9ee34b3cb79ae707dfeb0315
https://doi.org/10.3807/josk.2013.17.1.044
https://doi.org/10.3807/josk.2013.17.1.044
Publikováno v:
ETRI Journal. 34:122-125
A video signal through a high-density optical link has been demonstrated to show the reliability of optical link for highdata-rate transmission. To reduce optical point-to-point links, an electrical link has been utilized for control and clock signal
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5bf3be1b8a4576bde2b56c02b5cd17c9
https://doi.org/10.4218/etrij.12.0211.0078
https://doi.org/10.4218/etrij.12.0211.0078
Publikováno v:
Journal of Lightwave Technology. 26:1479-1485
An architecture of a passively assembled optical platform is suggested for a chip-to-chip optical interconnection system. The platform is constructed using all-fiber media for the optical paths: a fiber-embedded optical printed-circuit board (OPCB) a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c98e300aa23ad9c7728604e80ba49220
https://doi.org/10.1109/jlt.2008.922166
https://doi.org/10.1109/jlt.2008.922166
Autor:
Sang-Won Ha, Kyoung Up Shin, Han Seo Cho, Sun Tea Jung, Byoung-Ho Rhee, Hyo-Hoon Park, Sae-Kyoung Kang, Byung Sup Rho, Taeil Kim, Dong Su Kim, Mu Hee Cho
Publikováno v:
Journal of Micromechanics and Microengineering. 14:1181-1184
We fabricated fiber-embedded boards using a micro-grooving technique for optical interconnects. This approach is quite cost effective and fully compatible with conventional PCB processes. U-shaped grooves were formed on FR-4 plates using a 90? V-shap
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1553cb59f9eab02f20e450571024775b
https://doi.org/10.1088/0960-1317/14/8/009
https://doi.org/10.1088/0960-1317/14/8/009
Publikováno v:
IEEE Photonics Technology Letters. 23:1403-1405
We have fabricated 2.5-Gb/s/ch long wavelength optical transmitter modules in planar and multichip module structures for chip-to-chip optical printed-circuit board (OPCB) applications. Their performance has been analyzed and compared with two types o
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::332152b0b42f036a2c8085e3b69efb88
https://doi.org/10.1109/lpt.2011.2161576
https://doi.org/10.1109/lpt.2011.2161576