Zobrazeno 1 - 10
of 170
pro vyhledávání: '"Muñoz Rojo M"'
Autor:
Muñoz Rojo M; Acurable, London SW1H 0NB, UK., Pramono RXA; Wearable Technologies Lab, Department of Electrical and Electronic Engineering, Imperial College of Science Technology and Medicine, London SW7 2BX, UK., Devani N; Thoracic Medicine, Royal Free London NHS Foundation Trust, London NW3 2QG, UK., Thomas M; Acurable, London SW1H 0NB, UK., Mandal S; Thoracic Medicine, Royal Free London NHS Foundation Trust, London NW3 2QG, UK., Rodriguez-Villegas E; Wearable Technologies Lab, Department of Electrical and Electronic Engineering, Imperial College of Science Technology and Medicine, London SW7 2BX, UK.
Publikováno v:
Journal of clinical medicine [J Clin Med] 2024 Jun 20; Vol. 13 (12). Date of Electronic Publication: 2024 Jun 20.
Autor:
Roldán JB; Departamento de Electrónica y Tecnología de Computadores, Universidad de Granada, Facultad de Ciencias. Avenida Fuentenueva s/n, 18071 Granada, Spain., Cantudo A; Departamento de Electrónica y Tecnología de Computadores, Universidad de Granada, Facultad de Ciencias. Avenida Fuentenueva s/n, 18071 Granada, Spain., Maldonado D; Departamento de Electrónica y Tecnología de Computadores, Universidad de Granada, Facultad de Ciencias. Avenida Fuentenueva s/n, 18071 Granada, Spain.; IHP-Leibniz-Institut für innovative Mikroelektronik, 15236 Frankfurt (Oder), Germany., Aguilera-Pedregosa C; Departamento de Electrónica y Tecnología de Computadores, Universidad de Granada, Facultad de Ciencias. Avenida Fuentenueva s/n, 18071 Granada, Spain., Moreno E; CEMDATIC-E.T.S.I Telecomunicación, Universidad Politécnica de Madrid (UPM), 28040 Madrid, Spain., Swoboda T; Department of Thermal and Fluid Engineering, Faculty of Engineering Technology, University of Twente, 7500 AE Enschede, The Netherlands., Jiménez-Molinos F; Departamento de Electrónica y Tecnología de Computadores, Universidad de Granada, Facultad de Ciencias. Avenida Fuentenueva s/n, 18071 Granada, Spain., Yuan Y; Materials Science and Engineering Program, Physical Sciences and Engineering Division, King Abdullah University of Science and Technology (KAUST), Thuwal 23955-6900, Saudi Arabia., Zhu K; MIND, Department of Electronic and Biomedical Engineering, Universitat de Barcelona, Martí i Franquès 1, E-08028 Barcelona, Spain., Lanza M; Materials Science and Engineering Program, Physical Sciences and Engineering Division, King Abdullah University of Science and Technology (KAUST), Thuwal 23955-6900, Saudi Arabia., Muñoz Rojo M; 2D Foundry, Instituto de Ciencia de Materiales de Madrid (ICMM), CSIC, Madrid 28049, Spain.; Department of Thermal and Fluid Engineering, Faculty of Engineering Technology, University of Twente, 7500 AE Enschede, The Netherlands.
Publikováno v:
ACS applied electronic materials [ACS Appl Electron Mater] 2024 Feb 15; Vol. 6 (2), pp. 1424-1433. Date of Electronic Publication: 2024 Feb 15 (Print Publication: 2024).
Autor:
Zhu K; Materials Science and Engineering Program, Physical Science and Engineering Division, King Abdullah University of Science and Technology (KAUST), Thuwal, Saudi Arabia., Pazos S; Materials Science and Engineering Program, Physical Science and Engineering Division, King Abdullah University of Science and Technology (KAUST), Thuwal, Saudi Arabia., Aguirre F; Materials Science and Engineering Program, Physical Science and Engineering Division, King Abdullah University of Science and Technology (KAUST), Thuwal, Saudi Arabia., Shen Y; Materials Science and Engineering Program, Physical Science and Engineering Division, King Abdullah University of Science and Technology (KAUST), Thuwal, Saudi Arabia., Yuan Y; Materials Science and Engineering Program, Physical Science and Engineering Division, King Abdullah University of Science and Technology (KAUST), Thuwal, Saudi Arabia., Zheng W; Materials Science and Engineering Program, Physical Science and Engineering Division, King Abdullah University of Science and Technology (KAUST), Thuwal, Saudi Arabia., Alharbi O; Materials Science and Engineering Program, Physical Science and Engineering Division, King Abdullah University of Science and Technology (KAUST), Thuwal, Saudi Arabia., Villena MA; Materials Science and Engineering Program, Physical Science and Engineering Division, King Abdullah University of Science and Technology (KAUST), Thuwal, Saudi Arabia., Fang B; Materials Science and Engineering Program, Physical Science and Engineering Division, King Abdullah University of Science and Technology (KAUST), Thuwal, Saudi Arabia., Li X; Institute of Microelectronics, Tsinghua University, Beijing, China., Milozzi A; Department of Electronics, Information and Bioengineering, Politecnico of Milan, Milan, Italy., Farronato M; Department of Electronics, Information and Bioengineering, Politecnico of Milan, Milan, Italy., Muñoz-Rojo M; Department of Thermal and Fluid Engineering, Faculty of Engineering Technology, University of Twente, Enschede, the Netherlands.; Institute of Micro and Nanotechnology, IMN-CNM, CSIC (CEI UAM+CSIC), Madrid, Spain., Wang T; Institute of Functional Nano and Soft Materials, Collaborative Innovation Center of Suzhou Nanoscience and Technology, Soochow University, Suzhou, China., Li R; Computer, Electrical and Mathematical Sciences and Engineering Division, King Abdullah University of Science and Technology, Thuwal, Saudi Arabia., Fariborzi H; Computer, Electrical and Mathematical Sciences and Engineering Division, King Abdullah University of Science and Technology, Thuwal, Saudi Arabia., Roldan JB; Department of Electronics and Computer Technology, Faculty of Sciences, University of Granada, Granada, Spain., Benstetter G; Department of Electrical Engineering and Media Technology, Deggendorf Institute of Technology, Deggendorf, Germany., Zhang X; Materials Science and Engineering Program, Physical Science and Engineering Division, King Abdullah University of Science and Technology (KAUST), Thuwal, Saudi Arabia., Alshareef HN; Materials Science and Engineering Program, Physical Science and Engineering Division, King Abdullah University of Science and Technology (KAUST), Thuwal, Saudi Arabia., Grasser T; Institute for Microelectronics, TU Wien, Vienna, Austria., Wu H; Institute of Microelectronics, Tsinghua University, Beijing, China., Ielmini D; Department of Electronics, Information and Bioengineering, Politecnico of Milan, Milan, Italy., Lanza M; Materials Science and Engineering Program, Physical Science and Engineering Division, King Abdullah University of Science and Technology (KAUST), Thuwal, Saudi Arabia. mario.lanza@kaust.edu.sa.
Publikováno v:
Nature [Nature] 2023 Jun; Vol. 618 (7963), pp. 57-62. Date of Electronic Publication: 2023 Mar 27.
Autor:
Swoboda T; Department of Thermal and Fluid Engineering, Faculty of Engineering Technology, University of Twente, Enschede, The Netherlands. m.m.rojo@csic.es., Wainstein N; Faculty of Electrical Engineering, Technion - Israel Institute of Technology, Haifa, Israel., Deshmukh S; Department of Electrical Engineering, Stanford University, Stanford, USA., Köroğlu Ç; Department of Electrical Engineering, Stanford University, Stanford, USA., Gao X; Faculty of Science and Technology and MESA+ Institute for Nanotechnology, University of Twente, Enschede, The Netherlands., Lanza M; Materials Science and Engineering Program Physical Science and Engineering Division King Abdullah University of Science and Technology (KAUST), Thuwal, Saudi Arabia., Hilgenkamp H; Faculty of Science and Technology and MESA+ Institute for Nanotechnology, University of Twente, Enschede, The Netherlands., Pop E; Department of Electrical Engineering, Stanford University, Stanford, USA., Yalon E; Faculty of Electrical Engineering, Technion - Israel Institute of Technology, Haifa, Israel., Muñoz Rojo M; Department of Thermal and Fluid Engineering, Faculty of Engineering Technology, University of Twente, Enschede, The Netherlands. m.m.rojo@csic.es.; Instituto de Micro y Nanotecnología, IMN-CNM, CSIC (CEI UAM+CSIC), Madrid, Spain.
Publikováno v:
Nanoscale [Nanoscale] 2023 Apr 13; Vol. 15 (15), pp. 7139-7146. Date of Electronic Publication: 2023 Apr 13.
Akademický článek
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Autor:
Klinar K; Faculty of Mechanical Engineering, University of Ljubljana, Askerceva 6, 1000 Ljubljana, Slovenia., Vozel K; Faculty of Mechanical Engineering, University of Ljubljana, Askerceva 6, 1000 Ljubljana, Slovenia., Swoboda T; Department of Thermal and Fluid Engineering, University of Twente, 7500 AE Enschede, Overijssel, the Netherlands., Sojer T; Faculty of Mechanical Engineering, University of Ljubljana, Askerceva 6, 1000 Ljubljana, Slovenia., Muñoz Rojo M; Department of Thermal and Fluid Engineering, University of Twente, 7500 AE Enschede, Overijssel, the Netherlands.; Instituto de Micro y Nanotecnología, IMN-CNM, CSIC (CEI UAM+CSIC), Calle Isaac Newton 8, 28760 Tres Cantos, Madrid, Spain., Kitanovski A; Faculty of Mechanical Engineering, University of Ljubljana, Askerceva 6, 1000 Ljubljana, Slovenia.
Publikováno v:
IScience [iScience] 2022 Jan 15; Vol. 25 (2), pp. 103779. Date of Electronic Publication: 2022 Jan 15 (Print Publication: 2022).
Publikováno v:
Muñoz Rojo, M; Zhang, Y; Manzano, CV; Alvaro, R; Gooth, J; Salmeron, M; et al.(2016). Spatial potential ripples of azimuthal surface modes in topological insulator Bi2Te3nanowires. Scientific Reports, 6. doi: 10.1038/srep19014. Lawrence Berkeley National Laboratory: Retrieved from: http://www.escholarship.org/uc/item/5zp658c9
Topological insulators (TI) nanowires (NW) are an emerging class of structures, promising both novel quantum effects and potential applications in low-power electronics, thermoelectrics and spintronics. However, investigating the electronic states of
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=od_______325::64ee6d23dfc114767d7b359273c453ac
http://www.escholarship.org/uc/item/5zp658c9
http://www.escholarship.org/uc/item/5zp658c9
Autor:
Muñoz Rojo, M., Grauby, S., Rampnoux, J.-M., Caballero-Calero, O., Martin-Gonzalez, M., Dilhaire, S.
Publikováno v:
Journal of Applied Physics; Feb2013, Vol. 113 Issue 5, p054308, 7p, 1 Black and White Photograph, 3 Graphs
Akademický článek
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