Application of nanoindentation technique to extract properties of thin films through experimental and numerical analysis

Autor: Wymyslowski, A., Dowha, L., Wittler, O., Mrossko, R., Dudek, R.

One of the major topics in novel microelectronics are thin film materials - especially their mechanical properties. Accurate description of such materials is necessary in order to assess their reliability and to predict failures in electronic devices

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=od_______610::467420b42ae42fee035fb4ee3f9cd60e
https://publica.fraunhofer.de/handle/publica/223621

Transient thermal management by using double-sided assembling, thermo-electric cooling and phase-change based thermal buffer structures: Design, technology and application.

Autor: Springborn, M., Wunderle, B., May, D., Mrossko, R., Manier, C.-A., Ras, M. Abo, Oppermann, H., Xhonneux, T., Caroff, T., Mitova, R.

Publikováno v: 2015 21st International Workshop on Thermal Investigations of ICs & Systems (THERMINIC); 2015, p1-7, 7p

Phase change based thermal buffering of transient loads for power converter.

Autor: Wunderle, B., Springborn, M., May, D., Mrossko, R., Ras, M. Abo, Manier, C.-A., Oppermann, H., Mitova, R.

Publikováno v: 20th International Workshop on Thermal Investigations of ICs & Systems; 2014, p1-7, 7p

Thermal management of electrical overload cases using thermo-electric modules and phase change buffer techniques: Simulation, technology and testing.

Autor: Springborn, M., Wunderle, B., May, D., Mrossko, R., Manier, C.-A., Oppermann, H., Ras, M. Abo, Mitova, R.

Publikováno v: 2014 15th International Conference on Thermal, Mechanical & Multi-Physics Simulation & Experiments in Microelectronics & Microsystems (EuroSimE); 2014, p1-11, 11p

Double-sided cooling and thermo-electrical management of power transients for silicon chips on DCB-substrates for converter applications: Design, technology and test.

Autor: Wunderle, B., Manier, C.-A., Ras, M. Abo, Springborn, M., May, D., Oppermann, H., Toepper, M., Mrossko, R., Xhonneux, T., Caroff, T., Maurer, W., Mitova, R.

Publikováno v: 19th International Workshop on Thermal Investigations of ICs & Systems (THERMINIC); 2013, p253-261, 9p