Zobrazeno 1 - 10
of 18
pro vyhledávání: '"Motoki Eto"'
Autor:
Stefan Schmitz, Noritoshi Araki, Motoki Eto, Tadashi Yamaguchi, Teruo Haibara, Takashi Yamada
Publikováno v:
International Symposium on Microelectronics. 2021:000332-000338
This article focuses on the analysis of the interface formation of heavy wire bonding contacts. A test methodology is presented which combines the novel BAMFIT (Bondtec Accelerated Mechanical Fatigue Interface Testing) method, the 3D measurement of f
Publikováno v:
Microelectronics Reliability. 144:114956
Autor:
Robert Klengel, Sandy Klengel, Sebastian Tismer, Thomas Ackermann, Noritoshi Araki, Motoki Eto, Teruo Haibara, Takashi Yamada, Jochen Feldmann, Ralph Binner, Henk Peters, Achim Scheer, Vincent Chee
Publikováno v:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
Autor:
Motoki Eto, Teruo Haibara, Noritoshi Araki, Uno Tomohiro, Ohkabe Takumi, Oyamada Tetsuya, Yamada Takashi
Publikováno v:
International Symposium on Microelectronics. 2019:000524-000529
In this paper, a new type of silver (Ag) alloy bonding wire is introduced, and its bonding property and long term reliability are demonstrated. The new Ag wire, called GX2s, is developed as a cost-effective alternative to gold (Au) wire targeting at
Autor:
Teruo Haibara, Takashi Yamada, Robert Klengel, Noritoshi Araki, Jan Schischka, Motoki Eto, Sandy Klengel
Publikováno v:
2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC).
Silver (Ag) bonding wires are mainly used in consumer products as a reliable low-cost alternative to gold (Au) bonding wires. In automotive applications, the materials are exposed to particularly harsh environmental conditions. In order to understand
Publikováno v:
2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC).
During the past ten years, copper (Cu) bond wires have increasingly replaced gold (Au) wire materials. While this development began in the consumer electronics sector, Cu wires are now increasingly advancing into applications with challenging environ
Autor:
Robert Klengel, Takashi Yamada, Tino Stephan, Motoki Eto, Jan Schischka, Sandy Klengel, Matthias Petzold, Noritoshi Araki
Publikováno v:
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
During the past ten years, copper (Cu) bond wires have extensively replaced gold (Au) wire materials. While this development began in the consumer electronics sector, Cu wires are now increasingly advancing into applications with challenging environm
Publikováno v:
Microelectronics Reliability. 120:114125
Palladium coated copper (PCC) wire has been increasingly used in the semiconductor package in the last 10 years, especially in consumer products as a low-cost alternative to gold (Au) bonding wire. However, the PCC wire is still not widely used in th
Autor:
Tino Stephan, Jan Schischka, Robert Klengel, Noritoshi Araki, Sandy Klengel, Matthias Petzold, Motoki Eto, Takashi Yamada
Publikováno v:
2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC).
We present studies for a newly developed gold-palladium coated copper wire with focus to the automotive industry. This wire material was designed to prevent halide induced interface corrosion and also sulphur induced pitting corrosion. The base mater
Autor:
Falk Naumann, Sandy Klengel, Matthias Petzold, Motoki Eto, Takashi Yamada, Georg Lorenz, Robert Klengel, Noritoshi Araki
Publikováno v:
2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC).
In this study we present a newly developed gold-palladium coated copper (EX1R) wire with focus on automotive industry. By using an advanced material composition, halide induced interface corrosion and also sulphur induced pitting corrosion can be pre