Zobrazeno 1 - 7
of 7
pro vyhledávání: '"Motoharu Haga"'
Publikováno v:
2023 International Conference on Electronics Packaging (ICEP).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7b63bdac97f6820926b4f734503dbbab
https://doi.org/10.23919/icep58572.2023.10129766
https://doi.org/10.23919/icep58572.2023.10129766
Autor:
Shuaijie Zhao, Chuantong Chen, Motoharu Haga, Minoru Ueshima, Hidetoshi Hirahara, Jing Sang, Sung hun Cho, Tohru Sekino, Katsuaki Suganuma
Publikováno v:
Composites Part B: Engineering. 254:110562
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d77953f6518399c237603b0cb8d9f5a0
https://doi.org/10.1016/j.compositesb.2023.110562
https://doi.org/10.1016/j.compositesb.2023.110562
Publikováno v:
2022 International Conference on Electronics Packaging (ICEP).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b5e1566949f287ade73dc99b2a0457fb
https://doi.org/10.23919/icep55381.2022.9795526
https://doi.org/10.23919/icep55381.2022.9795526
Publikováno v:
SSRN Electronic Journal.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b68a1ff6ff0da52e860e59eb231b141f
https://doi.org/10.2139/ssrn.4114018
https://doi.org/10.2139/ssrn.4114018
Publikováno v:
Applied Surface Science. 608:155165
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::261560ba6871e6e9a156514eb7887524
https://doi.org/10.1016/j.apsusc.2022.155165
https://doi.org/10.1016/j.apsusc.2022.155165
Publikováno v:
Journal of Electronic Materials. 32:1483-1489
The formation process of solidification defects in solder fillet of circuit boards with a small outline package (SOP) soldered with Sn-3wt.%Ag-0.5wt.%Cu has been examined primarily by using an in-situ observation system and solidification simulation
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2195b58ad5260b0987068f03b378a2fa
https://doi.org/10.1007/s11664-003-0118-y
https://doi.org/10.1007/s11664-003-0118-y
Publikováno v:
Advancing Microelectronics; 2023, Vol. 50 Issue 3, p34-37, 4p