Zobrazeno 1 - 4
of 4
pro vyhledávání: '"Moskvinova, A."'
Autor:
Waechtler, Thomas, Oswald, Steffen, Roth, Nina, Jakob, Alexander, Lang, Heinrich, Ecke, Ramona, Schulz, Stefan E., Gessner, Thomas, Moskvinova, Anastasia, Schulze, Steffen, Hietschold, Michael
Publikováno v:
Journal of The Electrochemical Society, Vol. 156, No. 6, pp. H453-H459 (2009); Digital Object Identifier (DOI): 10.1149/1.3110842
The thermal atomic layer deposition (ALD) of copper oxide films from the non-fluorinated yet liquid precursor bis(tri-n-butylphosphane)copper(I)acetylacetonate, [(nBu3P)2Cu(acac)], and wet O2 on Ta, TaN, Ru and SiO2 substrates at temperatures of < 16
Autor:
Waechtler, T., Oswald, S., Roth, N., Jakob, A., Lang, H., Ecke, R., Schulz, S.E., Gessner, T., Moskvinova, A., Schulze, S., Hietschold, M.
Publikováno v:
Journal of The Electrochemical Society, Vol. 156, No. 6, pp. H453-H459 (2009); Digital Object Identifier (DOI): 10.1149/1.3110842
The thermal atomic layer deposition (ALD) of copper oxide films from the non-fluorinated yet liquid precursor bis(tri-n-butylphosphane)copper(I)acetylacetonate, [(nBu3P)2Cu(acac)], and wet O2 on Ta, TaN, Ru and SiO2 substrates at temperatures of < 16
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=dedup_wf_001::773d0b20091de783d7362099c50ee2db
https://monarch.qucosa.de/id/qucosa:19121
https://monarch.qucosa.de/id/qucosa:19121
Autor:
A. Moskvinova, Michael Hietschold, Stefan E. Schulz, Steffen Schulze, Ramona Ecke, I. Schubert
Publikováno v:
EMC 2008 14th European Microscopy Congress 1–5 September 2008, Aachen, Germany ISBN: 9783540851547
Successful copper investigation is a key for the newest technologies. Today copper becomes a more and more widespread material in interconnect technology. Its main advantages are a lower resistivity, high conductivity and high purity. Thin copper fil
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::67572ba44ddde2fecb9a3ff6141fce82
https://doi.org/10.1007/978-3-540-85156-1_374
https://doi.org/10.1007/978-3-540-85156-1_374
Autor:
Nina Roth, Steffen Oswald, Michael Hietschold, Thomas Waechtler, Heinrich Lang, Alexander Jakob, Anastasia Moskvinova, Stefan E. Schulz, Ramona Ecke, Thomas Gessner, Steffen Schulze
Publikováno v:
Journal of The Electrochemical Society. 156:H453
The thermal atomic layer deposition (ALD) of copper oxide films from the nonfluorinated yet liquid precursor bis(tri-n-butylphosphane)copper(I)acetylacetonate, [( n Bu 3 P) 2 Cu(acac)], and wet O 2 on Ta, TaN, Ru, and SiO 2 substrates at temperatures
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2764d4cb10bbda72b6a75e3e0f44adbb
https://doi.org/10.1149/1.3110842
https://doi.org/10.1149/1.3110842
