Zobrazeno 1 - 10
of 34
pro vyhledávání: '"Morteza Nabavi"'
Autor:
Sayed Alireza Sajjadi, Sayed Alireza Sadrossadat, Ali Moftakharzadeh, Morteza Nabavi, Mohamad Sawan
Publikováno v:
IEEE Access, Vol 12, Pp 113944-113959 (2024)
In this paper, we propose a method based on deep neural networks for the statistical design of flip-flops, taking into account nonlinear performance constraints. Flip-flop design and manufacturing are influenced by random variations in the technologi
Externí odkaz:
https://doaj.org/article/2bbeab0115fa470ea14ec7bf132bd1d9
Publikováno v:
Advanced Electronic Materials, Vol 9, Iss 6, Pp n/a-n/a (2023)
Abstract The memristor, which Leon Chua discovered in 1971 and Hewlett Packard fabricated for the first time in 2008, is still facing many design and fabrication challenges. Luckily, memristor emulators using mature Complementary Metal Oxide Semicond
Externí odkaz:
https://doaj.org/article/6a66742274934b358bf1108e177303a2
Publikováno v:
IEEE Access, Vol 10, Pp 127996-128006 (2022)
This paper proposes a hybrid approach combining Recurrent Neural Network (RNN) and polynomial regression methods for time-domain modeling of nonlinear circuits. The proposed hybrid RNN-polynomial regression (HRPR) method merges RNN and polynomial reg
Externí odkaz:
https://doaj.org/article/8559d56068314460b6d6f1511c0a119b
Autor:
Ali Forghani Elah Abadi, Seyyed Amir Asghari, Mohammadreza Binesh Marvasti, Golnoush Abaei, Morteza Nabavi, Yvon Savaria
Publikováno v:
IEEE Access, Vol 10, Pp 44123-44135 (2022)
One of the most important topics in the field of wireless sensor networks is the development of approaches to improve network lifetime. In this paper, an energy-efficient control and routing protocol for wireless sensor networks is presented. This al
Externí odkaz:
https://doaj.org/article/f7bb7f3d601f49fea10d3ef57a1b9c96
Autor:
Reza Gholami Taghizadeh, Mohammadreza Binesh Marvasti, Seyyed Amir Asghari, Ramin Gholami Taghizadeh, Morteza Nabavi, Yvon Savaria
Publikováno v:
IEEE Access, Vol 10, Pp 4934-4947 (2022)
One of the most important features of solid-state drives (SSDs) is the ability to update data sectors out of place, performing garbage collection operations within its physical blocks, to mitigate limited flash memory lifespan. In SSDs, a firmware ca
Externí odkaz:
https://doaj.org/article/adea9ed1f4a340568c440311a50bd503
Autor:
Mohamed Ali, Ahmad Hassan, Mohammad Honarparvar, Morteza Nabavi, Yves Audet, Mohamad Sawan, Yvon Savaria
Publikováno v:
IEEE Access, Vol 10, Pp 24540-24555 (2022)
We present in this paper design considerations and implementation challenges of a proposed versatile SoC/SiP sensor interface intended for industrial applications. The proposed interface involves high-voltage circuits such as class-D power amplifiers
Externí odkaz:
https://doaj.org/article/7bcaed7241be4db995e9097bf83827ab
Publikováno v:
Frontiers in Neuroscience, Vol 15 (2021)
Scaling down technology demotes the parameters of AC-coupled neural amplifiers, such as increasing the low-cutoff frequency due to the short-channel effects. To improve the low-cutoff frequency, one solution is to increase the feedback capacitors' va
Externí odkaz:
https://doaj.org/article/e747a6887b2340b8a8edb49455f3073a
Autor:
Ouafaa Ettahri, Aziz Oukaira, Mohamed Ali, Ahmad Hassan, Morteza Nabavi, Yvon Savaria, Ahmed Lakhssassi
Publikováno v:
Sensors, Vol 20, Iss 19, p 5657 (2020)
This paper proposes a real-time thermal monitoring method using embedded integrated sensor interfaces dedicated to industrial integrated system applications. Industrial sensor interfaces are complex systems that involve analog and mixed signals, wher
Externí odkaz:
https://doaj.org/article/1a2950aaa65b406f84b7a63820d59e80
Publikováno v:
Sensors, Vol 20, Iss 3, p 904 (2020)
The recently growing progress in neuroscience research and relevant achievements, as well as advancements in the fabrication process, have increased the demand for neural interfacing systems. Brain−machine interfaces (BMIs) have been revealed to be
Externí odkaz:
https://doaj.org/article/c0570a12ba344d2e9d4551b3360bb07a
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. :1-1
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::25d60f61a354d2572f6edc97a7f0c025
https://doi.org/10.1109/tcpmt.2023.3279098
https://doi.org/10.1109/tcpmt.2023.3279098