Zobrazeno 1 - 10
of 89
pro vyhledávání: '"Morten Stendahl Jellesen"'
Publikováno v:
Heliyon, Vol 10, Iss 11, Pp e31995- (2024)
The corrosion behavior of alloy Ni 201 in molten sodium hydroxide (NaOH) at 600 °C was investigated at varying basicity levels of the molten NaOH. The ability for Ni 201 to form passivating oxides was investigated after immersion tests varying from
Externí odkaz:
https://doaj.org/article/c33ea961814d4698aa791210768e426a
Autor:
Úlfar Arinbjarnar, Rune Juul Christiansen, Maximilian Knoll, Karen Pantleon, Morten Stendahl Jellesen, Chris Valentin Nielsen
Publikováno v:
Journal of Manufacturing and Materials Processing, Vol 7, Iss 5, p 174 (2023)
Straining of sheet metal leads to surface roughness changes. In this study, foils of AISI 201 and AISI 304 stainless steel were strained in uniaxial tension to impose roughening of their surfaces. Thereafter, the corrosion resistance, electrical resi
Externí odkaz:
https://doaj.org/article/ba3d18044b0f4ef685f3400abf14f00f
Autor:
Morten Stendahl Jellesen, Trine Nybo Lomholt, Rikke Quist Hansen, Troels Mathiesen, Carsten Gundlach, Søren Kold, Tobias Nygaard, Mindaugas Mikuzis, Ulrik Kähler Olesen, Jan Duedal Rölfing
Publikováno v:
Acta Orthopaedica, Vol 92, Iss 5, Pp 621-627 (2021)
Background and purpose — We noted several adverse events in patients in whom the first version of the STRYDE limb-lengthening nail (NuVasive Specialized Orthopaedics, San Diego, CA) had been implanted. Pain, osteolysis, periosteal reactions, and co
Externí odkaz:
https://doaj.org/article/9b2cfc48361f45058e3893eab17b8d67
Publikováno v:
Li, F, Mantis, I, Jellesen, M S & Ambat, R 2022, ' Amino acids as activators for wave solder flux systems: Investigation of solderability and humidity effects ', IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 12, no. 5, pp. 857-868 . https://doi.org/10.1109/TCPMT.2022.3167389
The role of flux activators in flux formulation is to remove oxides from metal surface, hence allow the formation of metallurgical bond between metal substrate and solder alloy. However, flux activator in the no-clean flux residue on printed circuit
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::8b0c230debb09696cfef22dd8ec9838d
https://doi.org/10.1109/tcpmt.2022.3167389
https://doi.org/10.1109/tcpmt.2022.3167389
Publikováno v:
Journal of Materials Science: Materials in Electronics. 33:10234-10250
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::47f4d6ba303933f7a589773dc52fc448
https://doi.org/10.1007/s10854-022-08012-3
https://doi.org/10.1007/s10854-022-08012-3
Publikováno v:
Soldering & Surface Mount Technology, 2015, Vol. 27, Issue 4, pp. 146-156.
Externí odkaz:
http://www.emeraldinsight.com/doi/10.1108/SSMT-11-2014-0022
Autor:
Melanie Montgomery, Morten Stendahl Jellesen, Peiyuan Pan, Rajan Ambat, Kamila Piotrowska, Heng Chen
Publikováno v:
Energy & Fuels. 35:8006-8022
At the “cold-end” of biomass and coal-fired plants, with decreasing temperature and increasing relative humidity (RH) of the flue gas, moisture absorption by the hygroscopic deposits may electroche...
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f9495a3eb8ecf8cf74be046fe19dbe92
https://doi.org/10.1021/acs.energyfuels.0c04221
https://doi.org/10.1021/acs.energyfuels.0c04221
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 11:324-332
A common concern with electronics packaging is the reduction of moisture ingress into the devices. One option to consider is the use of water absorption desiccant. Its criteria for selection should be its water capacity property, while its regenerati
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5b28c89ac37e023ec47fd9710556bdb5
https://doi.org/10.1109/tcpmt.2020.3045495
https://doi.org/10.1109/tcpmt.2020.3045495
Publikováno v:
Journal of Materials Science: Materials in Electronics. 32:4961-4981
This paper systematically investigates the humidity robustness and solderability of five alkanolamines used as activators in flux systems, and their effect was assessed along with the influence of soldering temperature. Electrochemical impedance spec
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::36dab8cdc710f028177266c1f0d0571a
https://doi.org/10.1007/s10854-020-05235-0
https://doi.org/10.1007/s10854-020-05235-0
Publikováno v:
Joshy, S, Verdingovas, V, Jellesen, M S & Ambat, R 2019, ' Circuit analysis to predict humidity related failures in electronics-Methodology and recommendations ', Microelectronics Reliability, vol. 93, pp. 81-88 . https://doi.org/10.1016/j.microrel.2018.12.010
Aim of this paper is to demonstrate the use of circuit analysis to predict humidity robustness of an electronic circuit design. There is a lack of design tools which can predict failures due to humidity, especially the effect of humidity on electrica
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::47a9d7862dcca4bc04e28b8d9a3057d8
https://doi.org/10.1016/j.microrel.2018.12.010
https://doi.org/10.1016/j.microrel.2018.12.010