Zobrazeno 1 - 10
of 15
pro vyhledávání: '"Moriz Jelinek"'
Autor:
Thomas Wuebben, Moriz Jelinek, Martin Faccinelli, Hans-Joachim Schulze, Peter Hadley, Johannes Georg Laven
Publikováno v:
physica status solidi c. 13:750-755
Autor:
Mathias Rommel, H.-J. Schulze, S. Kirnstoetter, Johannes Georg Laven, Moriz Jelinek, Lothar Frey, Werner Schustereder
Publikováno v:
Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms. 365:240-243
In this study we examine proton implanted and subsequently annealed commercially available CZ wafers with the DLTS method. Depth-resolved spreading resistance measurements are shown, indicating an additional peak in the induced doping profile, not se
Autor:
Reinhart Job, Moriz Jelinek, Lothar Frey, H.-J. Schulze, Werner Schustereder, Naveen Ganagona, Mathias Rommel, Johannes Georg Laven
Publikováno v:
Solid State Phenomena. 242:169-174
Two metastable defects with energy levels at Ec-0.28eV and Ec-0.37eV, which previously have been reported in proton implanted- and in proton implanted and annealed crystalline silicon are discussed. Recent results on the peculiar behavior of these de
Autor:
Mathias Rommel, Moriz Jelinek, Lothar Frey, Werner Schustereder, H.-J. Schulze, Naveen Ganagona, Johannes Georg Laven
Publikováno v:
Solid State Phenomena. 242:175-183
– For a conventional proton implantation doping process applied to crystalline silicon comprising proton implantation and subsequent furnace annealing the effect of the substrate temperature set during implantation is examined for temperatures betw
Autor:
Laurent Roux, Philippe Godignon, Moriz Jelinek, Marcin Zielinski, Yohann Spiegel, Frank Torregrosa, Gael Borvon, Werner Schustereder, Thomas Wuebben, Guillaume Sempere, Frederic Morancho
Publikováno v:
22nd International Conference on Ion Implantation Technology (IIT)
22nd International Conference on Ion Implantation Technology (IIT), Sep 2018, Würzburg, Germany. 5p., ⟨10.1109/IIT.2018.8807978⟩
22nd International Conference on Ion Implantation Technology (IIT), Sep 2018, Würzburg, Germany. 5p., ⟨10.1109/IIT.2018.8807978⟩
International audience; Thanks to its high throughput and low cost of ownership Plasma Immersion Ion Implantation (or Plasma Doping) has been widely used for Memory device fabrication. Its ability to implant very high doses in shallow layers, makes i
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::5d0e051c511493dd9e5079716cf2e415
https://hal.laas.fr/hal-01955688/document
https://hal.laas.fr/hal-01955688/document
Autor:
Moriz Jelinek, Werner Schustereder, Lothar Frey, H.-J. Schulze, Reinhart Job, Mathias Rommel, Johannes Georg Laven
Publikováno v:
physica status solidi (b). 251:2189-2192
Deep-level defects remaining in the upper half of the band-gap of silicon implanted with protons at fluences and annealing temperatures typically used for proton-implantation doping are investigated. For proton fluences in the range of several 1013 c
Autor:
Stefan Kirnstoetter, Martin Faccinelli, Peter Hadley, Johannes Georg Laven, Moriz Jelinek, Hans-Joachim Schulze, Werner Schustereder
Publikováno v:
physica status solidi c. 11:1707-1710
Electron Beam Induced Current (EBIC) measurements were used to produce cross sectional images of superjunction power transistors. These images show how the depletion width expands under reverse bias. Superjunctions are alternating p- and n-type doped
Autor:
Christian Gspan, Stefan Kirnstoetter, Johannes Georg Laven, Werner Grogger, Werner Schustereder, Peter Hadley, Moriz Jelinek, Hans-Joachim Schulze, Martin Faccinelli
Publikováno v:
physica status solidi c. 11:1545-1550
Proton (H+) implantations are used in power semiconductor devices to introduce recombination centers (Hazdra et al., Microelectron. J. 32(5), 449–456 (2001)) or to form hydrogen related donor complexes (Zohta et al., Jpn. J. Appl. Phys. 10, 532–5
Autor:
H.-J. Schulze, Martin Faccinelli, Peter Hadley, Stefan Kirnstötter, Johannes Georg Laven, Moriz Jelinek, Werner Schustereder
Publikováno v:
Solid State Phenomena. :311-316
Protons with energies of 1 MeV and 2.5 MeV were implanted into a p-doped silicon wafer and then the wafer was annealed at 350 °C for one hour. This resulted in two n-doped layers in the otherwise p-doped sample. The carrier concentration was measure
Autor:
Mario Lugger, Nicolas Siedl, Moriz Jelinek, Werner Schustereder, Christian Krueger, Mathias Wagner
Publikováno v:
2016 21st International Conference on Ion Implantation Technology (IIT).
Semiconductor technology needs the control of processes on wafer level. For ion implanation control there are two well established methods, namely the photothermal response techniques on as-implanted product or monitor wafers and the determination of