Zobrazeno 1 - 2
of 2
pro vyhledávání: '"Moritz Jurgschat"'
Publikováno v:
International Symposium on Microelectronics. 2017:000563-000568
Advanced packaging technologies have ramped up to provide solutions for new high density devices that are based on the integration of several components with different functions. The need for thin packages with memory, APU, modem and analog all packe
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2eca892551d8fb4cec4ae0cfa9ede701
https://doi.org/10.4071/isom-2017-tha32_055
https://doi.org/10.4071/isom-2017-tha32_055
Publikováno v:
2017 28th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC).
Through Silicon Via (TSV) processing is crucial for the later performance and reliability of a device. Therefore, an accurate and efficient metrology loop to control and inspect underlying production steps is essential. Specifically, the TSV depth is
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f49597971d984cbd7d689c5421bf33e0
https://doi.org/10.1109/asmc.2017.7969211
https://doi.org/10.1109/asmc.2017.7969211