Zobrazeno 1 - 10
of 18
pro vyhledávání: '"Montse Vilarrubí"'
Autor:
Álvaro Fernández, Joana Rosell-Mirmi, Desideri Regany, Montse Vilarrubí, Jérôme Barrau, Manel Ibañez, Joan Rosell-Urrutia
Publikováno v:
Energies, Vol 17, Iss 5, p 1235 (2024)
Efficiency losses resulting from electrical mismatching in densely packed photovoltaic arrays present a significant challenge, particularly exacerbated in nonuniformly illuminated receivers and under varying temperatures. Serial configurations are pa
Externí odkaz:
https://doaj.org/article/4d5564da86a34fd1916aaa609a08101e
Autor:
Desideri Regany, Francesc Majós, Jérôme Barrau, Joan Rosell, Manuel Ibáñez, Luc G. Fréchette, Montse Vilarrubí
Publikováno v:
Repositorio Abierto de la UdL
Universitad de Lleida
Universitad de Lleida
Thermal management complexity increases in high-performance chips, where the heat loads vary spatially and temporally, while liquid cooling systems are usually designed for most stringent stationary conditions. Several works developed heat transfer e
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::0a3b750c480988e4bf81af21471850ed
https://hdl.handle.net/10459.1/73177
https://hdl.handle.net/10459.1/73177
Autor:
Álvaro Fernández, Joana Rosell Mirmi, Desideri Regany, Montse Vilarrubí, Jérôme Barrau, Manel Ibañez, Joan Rosell-Urrutia
Publikováno v:
SSRN Electronic Journal.
Autor:
Jérôme Barrau, Manel Ibañez, Luc G. Fréchette, Montse Vilarrubí, Gerard Laguna, Sara Riera, Mohamed Omri
Publikováno v:
International Journal of Thermal Sciences
International Journal of Thermal Sciences, Elsevier, 2018, 132, pp.424-434. ⟨10.1016/j.ijthermalsci.2018.06.019⟩
International Journal of Thermal Sciences, Elsevier, 2018, 132, pp.424-434. ⟨10.1016/j.ijthermalsci.2018.06.019⟩
Current technologies for the cooling of high power integrated circuits (IC) chips employ single-phase liquid flow through microchannel heat sinks. The surface temperature in these devices increases along the flow direction, leading to temperature non
Autor:
Jérôme Barrau, Montse Vilarrubí, Gonzalo Sisó, Álvaro Fernández, Joana Rosell-Mirmi, Joan Rosell-Urrutia, Gerard Laguna, Manuel Ibáñez
Publikováno v:
Micromachines, Vol 12, Iss 505, p 505 (2021)
Micromachines
Volume 12
Issue 5
Repositorio Abierto de la UdL
Universitad de Lleida
Micromachines
Volume 12
Issue 5
Repositorio Abierto de la UdL
Universitad de Lleida
This study presents a thermal analysis of a temperature-driven microfluidic cell through a nonlinear self-adaptive micro valve that provides the mechanisms for the system to maintain a given critical temperature in an efficient way. For the descripti
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::9563b3ed807d84120b85638a0305a804
https://hdl.handle.net/10459.1/72085
https://hdl.handle.net/10459.1/72085
Autor:
Montse Vilarrubí, Etienne Leveille, J. R. Rosell, Rajesh Pandiyan, Manel Ibañez, Jérôme Barrau, Amrid Amnache, Luc G. Fréchette, Gerard Laguna
Publikováno v:
Proc. of the 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
Proc. of the 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), Jul 2020, Orlando, United States. pp.48-52, ⟨10.1109/ITherm45881.2020.9190618⟩
Proc. of the 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), Jul 2020, Orlando, United States. pp.48-52, ⟨10.1109/ITherm45881.2020.9190618⟩
A novel microfluidic cooling solution, based on a microfluidic cell array with self-adaptive valves, for efficient cooling of time-varying and non-uniform heating in microelectronics. The proposed cooling device is formed by an array of microfluidic
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::9971c68cc1ad8c271f4f4201f4205677
https://hal.archives-ouvertes.fr/hal-03364835
https://hal.archives-ouvertes.fr/hal-03364835
Autor:
Gerard Laguna, Montse Vilarrubí, J.I. Rosell, Luc G. Fréchette, Jérôme Barrau, Sara Riera, Mohamed Omri
Publikováno v:
Heat and Mass Transfer
Heat and Mass Transfer, Springer Verlag, 2017, 53 (9), pp.2987-2997. ⟨10.1007/s00231-017-2045-0⟩
Heat and Mass Transfer, Springer Verlag, 2017, 53 (9), pp.2987-2997. ⟨10.1007/s00231-017-2045-0⟩
The impact of the thermal interface material (TIM) layer on the performance of a stepwise varying width microchannel cooling device is analysed. A numerical model shows that the TIM layer, besides its well known negative impact on the temperature, al
Publikováno v:
International Journal of Heat and Mass Transfer
International Journal of Heat and Mass Transfer, Elsevier, 2019, 139, pp.632-640. ⟨10.1016/j.ijheatmasstransfer.2019.05.028⟩
International Journal of Heat and Mass Transfer, Elsevier, 2019, 139, pp.632-640. ⟨10.1016/j.ijheatmasstransfer.2019.05.028⟩
Electronic cooling devices typically aim to provide low thermal resistance, however, for many applications, temperature non-uniformity across the cooled object is also a key parameter, as it impacts reliability. Tailored microchannels or fin layouts
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::290902cc75ec9ed5cfc1fdaaf649fdf4
https://hal.archives-ouvertes.fr/hal-02274489
https://hal.archives-ouvertes.fr/hal-02274489
Autor:
Montse Vilarrubí, Luc G. Fréchette, Jérôme Barrau, Amrid Amnache, Manel Ibañez, Gerard Laguna, Perceval Coudrain, Hassan Azarkish, Louis-Michel Collin, Josep Illa, Yina Betancourt
Publikováno v:
Applied Thermal Engineering
Applied Thermal Engineering, Elsevier, 2018, 144, pp.71-80. ⟨10.1016/j.applthermaleng.2018.08.030⟩
Recercat. Dipósit de la Recerca de Catalunya
instname
Repositorio Abierto de la UdL
Universitad de Lleida
Applied Thermal Engineering, Elsevier, 2018, 144, pp.71-80. ⟨10.1016/j.applthermaleng.2018.08.030⟩
Recercat. Dipósit de la Recerca de Catalunya
instname
Repositorio Abierto de la UdL
Universitad de Lleida
Thermal management in integrated chips is one of the major challenges on advanced microelectronics. The increase in power density is raising the need for microchannel liquid cooling solutions. Although this technology can accommodate high heat rates,
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::09394cf31345f2ea21cce9adc14b71ee
https://hal.archives-ouvertes.fr/hal-01921613
https://hal.archives-ouvertes.fr/hal-01921613
Autor:
Montse Vilarrubí, Gerard Laguna, Louis-Michel Collin, S Hamel, Jérôme Barrau, Amrid Amnache, Luc G. Fréchette
Publikováno v:
2018 24rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)
2018 24rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC), Sep 2018, Stockholm, Sweden. pp.1-6, ⟨10.1109/THERMINIC.2018.8593280⟩
2018 24rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC), Sep 2018, Stockholm, Sweden. pp.1-6, ⟨10.1109/THERMINIC.2018.8593280⟩
This work aims at developing a passive and thermoregulated microvalve in order to manage a local and adaptive cooling for microelectronics. Such microvalve can serve as flow regulators in an array of liquid cooling cells below a chip. Two Ag valves o
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::10f0b53aaf40f6178aa266dc75263e10
https://hal.archives-ouvertes.fr/hal-02073361
https://hal.archives-ouvertes.fr/hal-02073361