Zobrazeno 1 - 10
of 23
pro vyhledávání: '"Monflier, Richard"'
Autor:
Khaled, Mohamed Ali, Cancellara, Leonardo, Fekraoui, Salima, Daubriac, Richard, Bertran, François, Bigi, Chiara, Gravelier, Quentin, Monflier, Richard, Arnoult, Alexandre, Durand, Corentin, Plissard, Sébastien
Topological insulators (TI) are promising materials for future spintronics applications and their epitaxial integration would allow the realization of new hybrid interfaces. As the first materials studied, Bismuth Antimony alloys (Bi1-xSbx) show grea
Externí odkaz:
http://arxiv.org/abs/2405.14450
Autor:
Poumirol, Jean-Marie, Majorel, Clément, Chery, Nicolas, Girard, Christian, Wiecha, Peter R., Mallet, Nicolas, Larrieu, Guilhem, Cristiano, Fuccio, Monflier, Richard, Royet, Anne-Sophie, Alba, Pablo Acosta, Kerdiles, Sébastien, Paillard, Vincent, Bonafos, Caroline
We present the experimental realization of ordered arrays of hyper-doped silicon nanodisks, which exhibit a localized surface plasmon resonance. The plasmon is widely tunable in a spectral window between 2 and 5 $\mu$m by adjusting the free carrier c
Externí odkaz:
http://arxiv.org/abs/2011.07779
Autor:
Ghizzo, Lucien, Guibaud, Gérald, De Nardi, Christophe, Jamin, François, Chazal, Vanessa, Trémouilles, David, Monflier, Richard, Richardeau, Frédéric, Bascoul, Guillaume, González Sentís, Manuel
Publikováno v:
Journal of Failure Analysis & Prevention; Oct2024, Vol. 24 Issue 5, p2221-2231, 11p
Autor:
Ruggeri, Marina, Calenzo, Patrick, Morancho, Frédéric, Masoero, Lia, Germana, Rosalia, Nodari, Alessandro, Monflier, Richard
Publikováno v:
2023 35th International Symposium on Power Semiconductor Devices and ICs (ISPSD)
2023 35th International Symposium on Power Semiconductor Devices and ICs (ISPSD), May 2023, Hong Kong, China. pp.36-39, ⟨10.1109/ISPSD57135.2023.10147489⟩
2023 35th International Symposium on Power Semiconductor Devices and ICs (ISPSD), May 2023, Hong Kong, China. pp.36-39, ⟨10.1109/ISPSD57135.2023.10147489⟩
International audience; In this paper, we investigated the drain to source breakdown voltage (BVdss) instability during avalanche current drain stress of Shielded Gate MOSFET (SG-MOSFET) structure and we propose a new methodology to correlate electri
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=od______4074::be3e7d099642af0003a284be1d308cd5
https://hal.laas.fr/hal-04141241
https://hal.laas.fr/hal-04141241
Autor:
Julliard, P.L., Johnsson, A., Zographos, N., Demoulin, R., Monflier, Richard, Jay, A., Er-Riyahi, O., Monsieur, F., Joblot, S., Deprat, F., Rideau, D., Pichler, P., Hémeryck, Anne, Cristiano, Fuccio
Publikováno v:
Solid-State Electronics
Solid-State Electronics, 2023, 200, pp.108521. ⟨10.1016/j.sse.2022.108521⟩
Solid-State Electronics, 2023, 200, pp.108521. ⟨10.1016/j.sse.2022.108521⟩
International audience; Extended defects formed as a result of heated implantation and thermal annealing are studied using transmission electron microscopy and kinetic Monte Carlo simulations. We highlight the relevance of using kinetic Monte Carlo a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::f53c0f852ea84c447e6d73ee87cfbd33
https://hal.laas.fr/hal-03867418
https://hal.laas.fr/hal-03867418
Akademický článek
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Autor:
Chery, N, Zhang, M, Monflier, Richard, Seine, G, Paillard, V, Poumirol, J, Larrieu, Guilhem, Royet, A, Kerdilès, S, Acosta-Alba, P, Perego, M, Bonafos, Caroline, Cristiano, Fuccio
In this work, a thorough study of the phosphorus (P) heavy doping of thin Silicon-On-Insulator (SOI) layers by UV nanosecond Laser Thermal Annealing (LTA) is presented. The melting regimes and the regrowth processes as well as the redistribution and
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=dedup_wf_001::b2cfe69ec072db6046fb744fcf671aaa
https://hal.archives-ouvertes.fr/hal-03454821
https://hal.archives-ouvertes.fr/hal-03454821
Akademický článek
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Autor:
Monflier, Richard
Publikováno v:
Micro et nanotechnologies/Microélectronique. Université Toulouse 3 Paul Sabatier (UT3 Paul Sabatier), 2019. Français
Micro et nanotechnologies/Microélectronique. Université Paul Sabatier-Toulouse III, 2019. Français. ⟨NNT : 2019TOU30067⟩
Micro et nanotechnologies/Microélectronique. Université Paul Sabatier-Toulouse III, 2019. Français. ⟨NNT : 2019TOU30067⟩
The micro-electronic domain is constantly evolving in response to the continuous emerging of new application fields as well as new users' needs. The fabrication of heavily-doped regions for ultra-shallow junctions is a major issue to ensure its evolu
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=dedup_wf_001::2a113206ee4bbdff2a83a74001318e61
https://hal.laas.fr/tel-02162058/document
https://hal.laas.fr/tel-02162058/document
Autor:
Monflier, Richard
Publikováno v:
Micro et nanotechnologies/Microélectronique. Université Paul Sabatier-Toulouse III, 2019. Français. ⟨NNT : 2019TOU30067⟩
National audience; The micro-electronic domain is constantly evolving in response to the continuous emerging of new application fields as well as new users' needs. The fabrication of heavily-doped regions for ultra-shallow junctions is a major issue
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=od______2592::2a113206ee4bbdff2a83a74001318e61
https://hal.laas.fr/tel-02162058
https://hal.laas.fr/tel-02162058