Zobrazeno 1 - 10
of 72
pro vyhledávání: '"Moises Cases"'
Publikováno v:
IEEE Transactions on Advanced Packaging. 29:55-66
In this paper, a modeling methodology for macromodeling transistor-level receiver circuits has been presented. A few receiver modeling techniques have been proposed in the past, but these modeling techniques only address the loading effect of the rec
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4098bed3ed4d9dd10f3abc3bf98ff330
https://doi.org/10.1109/tadvp.2005.862646
https://doi.org/10.1109/tadvp.2005.862646
Autor:
D.N. de Araujo, Jamil A. Wakil, Stefano S. Oggioni, Edmund Blackshear, Ronald S Malfatt, S. R. Engle, Gareth G. Hougham, E. Klink, Moises Cases, David J. Russell, L. D. LaCroix, Nam H. Pham
Publikováno v:
IBM Journal of Research and Development. 49:641-661
This paper reviews sequential build-up (SBU) laminate substrate development from its beginning in 1988. It reports on developments in this technology for IBM applications since its adoption in 2000. These laminated substrates are nonuniform structure
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::99437c0b2e82e017a0453474151ad61a
https://doi.org/10.1147/rd.494.0641
https://doi.org/10.1147/rd.494.0641
Publikováno v:
IEEE Transactions on Advanced Packaging. 27:611-629
This paper discusses an efficient statistical analysis methodology for system-level signal integrity analysis. In the proposed method, statistical variations of the design and operational parameters are mapped to system performance through simulation
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9a13493c6d874cf01263d7e269c8b1fc
https://doi.org/10.1109/tadvp.2004.831856
https://doi.org/10.1109/tadvp.2004.831856
Publikováno v:
Introduction to Service Engineering
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6a540bc00bca79399a3bf9e0b6b464bd
https://doi.org/10.1002/9780470569627.ch6
https://doi.org/10.1002/9780470569627.ch6
Publikováno v:
2009 IEEE International Symposium on Electromagnetic Compatibility.
Prediction of radiation from multilayer circuit boards is an important problem which is of interest to the design of digital system such as servers. In particular, signal mode conversion as the result of undesired imbalances in the board interconnect
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c0b600fd191669d33f01b087b8408f4d
https://doi.org/10.1109/isemc.2009.5284560
https://doi.org/10.1109/isemc.2009.5284560
Publikováno v:
2009 59th Electronic Components and Technology Conference.
There is an increasing need for improved node density and better power efficiency in telecommunication market. In addition, the telecommunication server environment also requires rugged high system performance systems with compliance to rigorous stan
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3cea443590a315a898d0ea18054a245d
https://doi.org/10.1109/ectc.2009.5074277
https://doi.org/10.1109/ectc.2009.5074277
Publikováno v:
2008 10th Electronics Packaging Technology Conference.
With the increasing complexity of today's high speed electrical interfaces, electrical analysis of these interfaces is becoming exponentially complicated. Careful choice of channel design parameters for electrical modeling and analysis is becoming cr
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::77d0b772e14b3be28944615796f7b3ac
https://doi.org/10.1109/eptc.2008.4763412
https://doi.org/10.1109/eptc.2008.4763412
Publikováno v:
2008 IEEE-EPEP Electrical Performance of Electronic Packaging.
The design of telecommunication blade servers presents several conflicting electrical and mechanical parameters in terms of desired transmission frequencies, blade density, energy consumption, and total cost. This paper presents the design challenges
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f73c865be0e66ad49f4a7991457ee2d0
https://doi.org/10.1109/epep.2008.4675897
https://doi.org/10.1109/epep.2008.4675897
Publikováno v:
2008 IEEE-EPEP Electrical Performance of Electronic Packaging.
Surface mount capacitors can be replaced with a buried capacitor in backplane interconnect applications requiring blocking capacitance, such as FiberChannel. This replacement improves cost, reliability and parasitic inductance. The smaller nominal ca
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::cfff5f35ee8ee397a8506dfb5ba8cb56
https://doi.org/10.1109/epep.2008.4675938
https://doi.org/10.1109/epep.2008.4675938
Publikováno v:
2008 58th Electronic Components and Technology Conference.
The increased complexity of today's high speed systems is resulting in long pre-layout simulation times. Due to a multitude of design variables, many simulations are needed to locate the optimum design points. For a complex signal interface such as a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9c967f21c42b4464c2f508460976b456
https://doi.org/10.1109/ectc.2008.4550044
https://doi.org/10.1109/ectc.2008.4550044