Zobrazeno 1 - 3
of 3
pro vyhledávání: '"Mohd Yusuf Tura Ali"'
Autor:
Mohd Yusuf Tura Ali, Chu Yee Khor, Azwan Iskandar Azmi, Mohd Zulklifly Abdullah, Zambri Samsudin, Idris Mansor, Muhammad Irsyad Suhaimi, Muhammad Syahir Mahyuddin, Lai Ming Lim
Publikováno v:
ASEAN Engineering Journal. 12:205-210
Recent developments in the electronics industry have introduced a multi-stack ball grid array (BGA) to meet the growing consumer demand for both high-performance and smaller-sized chip packages. This study focused on the preliminary study of the Pack
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::dce9f5fd4b1cd38d008c247d093a8a33
https://doi.org/10.11113/aej.v12.17372
https://doi.org/10.11113/aej.v12.17372
Publikováno v:
Microelectronics International. 38:33-45
Purpose This paper aims to determine the optimum set of temperatures through correlation study to attain the most effective capillary flow of underfill in a multi-stack ball grid array (BGA) chip device. Design/methodology/approach Finite volume meth
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fc3b4ca26cea9e638566da146fea4c4b
https://doi.org/10.1108/mi-10-2020-0066
https://doi.org/10.1108/mi-10-2020-0066
Prediction of the void formation in no-flow underfill process using machine learning-based algorithm
Autor:
Muhammad Naqib Nashrudin, Fei Chong Ng, Aizat Abas, Mohd. Zulkifly Abdullah, Mohd. Yusuf Tura Ali, Zambri Samsudin
Publikováno v:
Microelectronics Reliability. 135:114586
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::60c28fb5c8e34cae952d77e3ad09eb94
https://doi.org/10.1016/j.microrel.2022.114586
https://doi.org/10.1016/j.microrel.2022.114586