Zobrazeno 1 - 3
of 3
pro vyhledávání: '"Mohd Raub AA"'
Autor:
Mohd Raub AA; Institute of Microengineering and Nanoelectronics (IMEN), Universiti Kebangsaan Malaysia (UKM), Bangi, 43600, Selangor, Malaysia., Bahru R; Institute of Microengineering and Nanoelectronics (IMEN), Universiti Kebangsaan Malaysia (UKM), Bangi, 43600, Selangor, Malaysia., Mohamed MA; Institute of Microengineering and Nanoelectronics (IMEN), Universiti Kebangsaan Malaysia (UKM), Bangi, 43600, Selangor, Malaysia., Latif R; Institute of Microengineering and Nanoelectronics (IMEN), Universiti Kebangsaan Malaysia (UKM), Bangi, 43600, Selangor, Malaysia., Mohammad Haniff MAS; Institute of Microengineering and Nanoelectronics (IMEN), Universiti Kebangsaan Malaysia (UKM), Bangi, 43600, Selangor, Malaysia., Simarani K; Institute of Biological Sciences, Faculty of Science, Universiti Malaya, Kuala Lumpur, 50603, Kuala Lumpur, Malaysia., Yunas J; Institute of Microengineering and Nanoelectronics (IMEN), Universiti Kebangsaan Malaysia (UKM), Bangi, 43600, Selangor, Malaysia.
Publikováno v:
Nanotechnology [Nanotechnology] 2024 Apr 02; Vol. 35 (24). Date of Electronic Publication: 2024 Apr 02.
Autor:
Zulkepli N; Institute of Microengineering and Nanoelectronic (IMEN), Universiti Kebangsaan Malaysia (UKM), Bangi 46300, Selangor, Malaysia.; Centre of Foundation Studies, Universiti Teknologi MARA, Cawangan Selangor, Kampus Dengkil, Dengkil 43800, Selangor, Malaysia., Yunas J; Institute of Microengineering and Nanoelectronic (IMEN), Universiti Kebangsaan Malaysia (UKM), Bangi 46300, Selangor, Malaysia., Mohammad Haniff MAS; Institute of Microengineering and Nanoelectronic (IMEN), Universiti Kebangsaan Malaysia (UKM), Bangi 46300, Selangor, Malaysia., Dedi; Research Center for Advanced Materials, National Research and Innovation Agency (BRIN), South Tangerang 15314, Banten, Indonesia., Sirat MS; Institute of Microengineering and Nanoelectronic (IMEN), Universiti Kebangsaan Malaysia (UKM), Bangi 46300, Selangor, Malaysia., Johari MH; Institute of Microengineering and Nanoelectronic (IMEN), Universiti Kebangsaan Malaysia (UKM), Bangi 46300, Selangor, Malaysia., Mohd Maidin NN; Institute of Microengineering and Nanoelectronic (IMEN), Universiti Kebangsaan Malaysia (UKM), Bangi 46300, Selangor, Malaysia., Mohd Raub AA; Institute of Microengineering and Nanoelectronic (IMEN), Universiti Kebangsaan Malaysia (UKM), Bangi 46300, Selangor, Malaysia., Hamzah AA; Institute of Microengineering and Nanoelectronic (IMEN), Universiti Kebangsaan Malaysia (UKM), Bangi 46300, Selangor, Malaysia.
Publikováno v:
Nanomaterials (Basel, Switzerland) [Nanomaterials (Basel)] 2024 Apr 01; Vol. 14 (7). Date of Electronic Publication: 2024 Apr 01.
Autor:
Kazmi J; Institute of Microengineering and Nanoelectronics, Universiti Kebangsaan Malaysia, 43600 Bangi, Selangor, Malaysia. ambri@ukm.edu.my., Raza SRA; Department of Physics, Allama Iqbal Open University, Islamabad-44000, Pakistan. raza_physics@hotmail.com., Ahmad W; Institute of Fundamental and Frontier Sciences, University of Electronic Science and Technology of China, Chengdu, 610054, China., Masood A; Institute of Microengineering and Nanoelectronics, Universiti Kebangsaan Malaysia, 43600 Bangi, Selangor, Malaysia. ambri@ukm.edu.my., Jalil A; Department of Physics, Allama Iqbal Open University, Islamabad-44000, Pakistan. raza_physics@hotmail.com., Mohd Raub AA; Institute of Microengineering and Nanoelectronics, Universiti Kebangsaan Malaysia, 43600 Bangi, Selangor, Malaysia. ambri@ukm.edu.my., Abbas A; Songshan Lake Materials Laboratory, University Innovation Park, Dongguan 523808, China., Rafiq MKS; Solar Energy Research Institute (SERI), Universiti Kebangsaan Malaysia (The National University of Malaysia), Bangi 43600, Malaysia., Mohamed MA; Institute of Microengineering and Nanoelectronics, Universiti Kebangsaan Malaysia, 43600 Bangi, Selangor, Malaysia. ambri@ukm.edu.my.
Publikováno v:
Physical chemistry chemical physics : PCCP [Phys Chem Chem Phys] 2023 May 24; Vol. 25 (20), pp. 14206-14218. Date of Electronic Publication: 2023 May 24.