Evaluation of Machine Learning Classifiers in Faulty Die Prediction to Maximize Cost Scrapping Avoidance and Assembly Test Capacity Savings in Semiconductor Integrated Circuit (IC) Manufacturing.

Autor: Mohd Fazil, Azlan Faizal, Mohd Shaharanee, Izwan Nizal, Jamil, Jastini Mohd

Publikováno v: AIP Conference Proceedings; 2019, Vol. 2138 Issue 1, p040010-1-040010-6, 6p, 3 Diagrams, 2 Charts, 1 Graph