Zobrazeno 1 - 10
of 16
pro vyhledávání: '"Mohd F. Abdulhamid"'
Publikováno v:
JOURNAL OF MECHANICAL ENGINEERING AND SCIENCES. 14:2488-2502
This paper describes a newly-developed damage-based fatigue life model for the long-Term reliability assessment of drawn steel wires and wire ropes. The methodology is based on the computed local stress field in the critical trellis contact zone of a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f480cce6f4f6f58d5d2430e97cbaa9aa
https://doi.org/10.15282/jmes.11.1.2017.8.0229
https://doi.org/10.15282/jmes.11.1.2017.8.0229
Autor:
Mohd F. Abdulhamid, Mohd Nasir Tamin, M.R. Jalal, Ab. Saman Abd. Kader, Hooi Siang Kang, Eduard Lotovskyi
Publikováno v:
Proceedings of the 29th European Safety and Reliability Conference (ESREL).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c843a5139e59fea06c7aa7d70416f80a
https://doi.org/10.3850/978-981-11-2724-3_1047-cd
https://doi.org/10.3850/978-981-11-2724-3_1047-cd
Autor:
Hooi Siang Kang, Mohd Nasir Tamin, M. Kamarudin, Ab. Saman Abd. Kader, Mohd F. Abdulhamid, S. Ahmad, S. Badshah
Publikováno v:
Proceedings of the 29th European Safety and Reliability Conference (ESREL).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::cce51eff9d509137107f1ffd80c1137c
https://doi.org/10.3850/978-981-11-2724-3_1081-cd
https://doi.org/10.3850/978-981-11-2724-3_1081-cd
Autor:
S. Ahmad, Mohd F. Abdulhamid, Ab. Saman Abd. Kader, S. Badshah, Mohd Nasir Tamin, Hooi Siang Kang
Publikováno v:
Safety and Reliability – Safe Societies in a Changing World ISBN: 9781351174664
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3dc540a40635b3c69bd77e55a2ab00c9
https://doi.org/10.1201/9781351174664-275
https://doi.org/10.1201/9781351174664-275
Autor:
Mohd F. Abdulhamid, Cemal Basaran
Publikováno v:
Mechanics of Materials. 41:1223-1241
High current density and high temperature gradient are major reliability concern for next generation nanoelectronic packaging and power electronics. High current density experiments on lead free solder joints coated with NiAu and non-coated Cu pads w
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::12fdb9f3f40b6289ba46022a75625572
https://doi.org/10.1016/j.mechmat.2009.07.004
https://doi.org/10.1016/j.mechmat.2009.07.004
Publikováno v:
IEEE Transactions on Advanced Packaging. 32:627-635
Competing mechanisms of electromigration and thermomigration in flip chip SnAgCu (SAC) solder joints were studied experimentally. A daisy chain of solder joints were stressed at 2.0 times 104 Amps/cm2, 2.4 times 104 Amps/cm2, and 2.8 times 104 Amps/c
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a44b7f0041aff3b816f02215b6c3047a
https://doi.org/10.1109/tadvp.2009.2018293
https://doi.org/10.1109/tadvp.2009.2018293
Publikováno v:
IEEE Transactions on Advanced Packaging. 32:478-485
Electromigration (EM) and thermomigration (TM) are processes of mass transport which are critical reliability issue for next generation nanoelectronics. The purpose of this project is to study the influence of low temperature on EM and TM interaction
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::bb36204511884f36d23fcadb4055eb80
https://doi.org/10.1109/tadvp.2008.2005840
https://doi.org/10.1109/tadvp.2008.2005840
Publikováno v:
SIMULATION. 84:391-401
Electromigration (EM) and thermomigration (TM) are processes of mass transport which are critical reliability issues for next generation nanoelectronics and power electronics. The purpose of this project is to develop a computational tool for simulat
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::05afdb5ca475a1661d6ce4da0fe30c96
https://doi.org/10.1177/0037549708094856
https://doi.org/10.1177/0037549708094856
Autor:
Cemal Basaran, Mohd F. Abdulhamid
Publikováno v:
Journal of Electronic Packaging. 131
Thermomigration experiments were conducted to study the change in mechanical properties of 95.5Sn–4Ag–0.5Cu (SAC405) lead-free solder joint under high temperature gradients. This paper presents some observations on samples that were subjected to
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8a7359fb842953bf5fb6570c9cfc3073
https://doi.org/10.1115/1.3068296
https://doi.org/10.1115/1.3068296
Publikováno v:
Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology.
The study of thermomigration on Sn-Ag-Cu solder sphere subjected to a high thermal gradient of 1100°C/cm is presented. After 286 hours, the hot end showed a thin and flat intermetallic compound (IMC) while the cold side showed a scallop-like Cu6Sn5
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::44d3183371b7986ff5ad422b7ce335ec
https://doi.org/10.1115/imece2006-13119
https://doi.org/10.1115/imece2006-13119