Zobrazeno 1 - 10
of 21
pro vyhledávání: '"Mohan Nagar"'
Autor:
Dr. Pawan Kumar Rawat, Dr. Rahul Agarwal, Dr. Yogesh Ahuja, Dr. Madan Mohan Nagar, Dr. Pranav Kothiyal, Dr. Kunal VIJ, Dr. Puneet Gupta
Publikováno v:
International Journal of Orthopaedics Sciences. 7:614-617
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::00d4b92700621f2662a808ee0b237ba0
https://doi.org/10.22271/ortho.2021.v7.i4i.2940
https://doi.org/10.22271/ortho.2021.v7.i4i.2940
Publikováno v:
International Journal of Orthopaedics Sciences. 3:114-117
Objective: BMD (bone mineral density) testing facilities are not available in every places in India. We compare the predictive ability of FRAX with BMD and FRAX without BMD for major osteoporotic and hip fracture in Himalayan population. Materials an
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::50ab1203021a9a22448d1a181ec109e0
https://doi.org/10.22271/ortho.2017.v3.i4b.19
https://doi.org/10.22271/ortho.2017.v3.i4b.19
Autor:
Madan Mohan Nagar, Jyoti Shukla, Pankaj Sharma, Yash Mohan Lal, Puneet Gupta, Sourabh Gupta, Navdeep Singh
Publikováno v:
International Journal of Orthopaedics Sciences. 3:336-343
Objective: Although several studies have done for relationship between obesity and bone mineral density (BMD), the results are inconclusive. The aim of this study was to further investigate the relation between age, weight, BMI and BMD in outpatients
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::971ae8b509cca74169cb5e0d9b5f832c
https://doi.org/10.22271/ortho.2017.v3.i4e.46
https://doi.org/10.22271/ortho.2017.v3.i4e.46
Publikováno v:
2017 IEEE 67th Electronic Components and Technology Conference (ECTC).
Today, applications like data center/cloud, mobility and Internet of Things (IoT) are key market drivers for semiconductor industry. To meet the requirements of next generation Information and Communication Technology (ICT) systems, the packaging tec
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6c026b8ca5403a0a2311ce594371ef7c
https://doi.org/10.1109/ectc.2017.208
https://doi.org/10.1109/ectc.2017.208
Autor:
Sada Patil, Jie Xue, Delacruz Javier A, Li Li, Jack Hellings, Marius Voicu, Mohan Nagar, Mark Coor, Bill Isaacson, Paul Ton, Pierre Chia, Ross Havens
Publikováno v:
2016 IEEE 66th Electronic Components and Technology Conference (ECTC).
To meet the requirements of the next high generation high-performance networking switches and routers, system integration based on the Three-dimensional (3D) System-in-Package (SiP) technology is being studied and developed. In this paper, we report
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8ec238f3e8baca9392c0612cdde6ef97
https://doi.org/10.1109/ectc.2016.246
https://doi.org/10.1109/ectc.2016.246
Publikováno v:
International Journal of Database Management Systems. 3:81-99
Wireless and mobile communication is an important technology that improves user’s daily life and facilitates the development of some new technology such as electronic commerce and mobile commerce. Replication is a fundamental technique for supporti
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9086d4059c45b480e909d4db42d0fd8f
https://doi.org/10.5121/ijdms.2011.3407
https://doi.org/10.5121/ijdms.2011.3407
Autor:
Rohith Sheshadri, Mohan Nagaraj, Avinash Lakshmikanthan, Manjunath Patel Gowdru Chandrashekarappa, Danil Yu Pimenov, Khaled Giasin, Raghupatruni Venkata Satya Prasad, Szymon Wojciechowski
Publikováno v:
Journal of Materials Research and Technology, Vol 14, Iss , Pp 2586-2600 (2021)
In the current study, near net-shaped selective laser melting (SLM) technology was employed to build nickel-based superalloy Inconel 625 (IN625) parts with good quality. Taguchi method was employed to formulate a systematical study, analyze, and opti
Externí odkaz:
https://doaj.org/article/9d2425bbe58049fba4faae8705a9ac10
Publikováno v:
2013 IEEE 63rd Electronic Components and Technology Conference.
With increasing data traffic requirements to support mobile devices, tablets and computers, the need for faster internet traffic is mushrooming. The routers and switches used to drive network traffic need to deliver high bandwidth and speed. Key to a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e34e07a9b327737dcac67e7dc18e54e8
https://doi.org/10.1109/ectc.2013.6575649
https://doi.org/10.1109/ectc.2013.6575649
Autor:
Mohan Nagar, A. Bansal, Choi HangChul, John Savic, Raj Pendse, Weidong Xie, Lee SangHo, Park Gun Oh, Mudasir Ahmad, David Senk, Nokibul Islam
Publikováno v:
2012 IEEE 62nd Electronic Components and Technology Conference.
High speed network packaging solutions have pushed the limits of known manufacturing technology into previously untested realms. Next generation ASIC's and SiP/MCM's are requiring packages in excess of 60mm × 60mm. These large package sizes present
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4e767c3bfb6ed51c9e726d7199350272
https://doi.org/10.1109/ectc.2012.6248870
https://doi.org/10.1109/ectc.2012.6248870
Autor:
Jie Xue, Mudasir Ahmad, Sue Teng, Judy Priest, Mohan Nagar, Ken Hubbard, Real Pomerleau, John Savic, Percy Aria
Publikováno v:
2010 Proceedings 60th Electronic Components and Technology Conference (ECTC).
High end networking and computing applications continue to drive silicon technologies for higher data rates and increased bandwidth. The push for silicon performance with 45nm and 32nm devices also drives a need for packaging performance to deliver c
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::581aba0a8ba709b6c587dd4e43296c6a
https://doi.org/10.1109/ectc.2010.5490845
https://doi.org/10.1109/ectc.2010.5490845