Zobrazeno 1 - 3
of 3
pro vyhledávání: '"Mohammed Fazil Fayaz"'
Autor:
Eric C. Harley, Alyssa Herbert, Anda Mocuta, Michael D. Steigerwalt, Colleen M. Snavely, Michael Brodfuehrer, Raymond Van Roijen, Meghan Linskey, Mohammed Fazil Fayaz
Publikováno v:
25th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2014).
Embedded SiGe, used to boost pFET performance, is grown by selective epitaxy on silicon. Pattern density effects cause the deposited thickness to be different across different product chips under otherwise identical conditions. Since device control d
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4d127626d48654bd651fe6c6da651f98
https://doi.org/10.1109/asmc.2014.6846982
https://doi.org/10.1109/asmc.2014.6846982
Publikováno v:
2010 IEEE/SEMI Advanced Semiconductor Manufacturing Conference (ASMC).
With billions of transistors being integrated on a single chip by modern VLSI manufacturing processes, traditional yield learning techniques based on defect density present serious drawbacks. Manufacturing process simulation and yield prediction tech
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fb7b6556303b5999afaeae91bc1b4edf
https://doi.org/10.1109/asmc.2010.5551472
https://doi.org/10.1109/asmc.2010.5551472
Autor:
Xian Bin Wang, Colin Hui, Subramanian Jayathi, Chi-Min Yuan, Laertis Economikos, Ushasree Katakamsetty, Xiang Hua, Tamba Gbondo-Tugbawa, Vikas Mehrotra, Kuang Han Chen, Song Li, Taber H. Smith, Mohammed Fazil Fayaz, Stephen E. Greco, Haigou Huang
Publikováno v:
SPIE Proceedings.
Chemical Mechanical Polishing (CMP) has been used in the manufacturing process for copper (Cu) damascene process. It is well known that dishing and erosion occur during CMP process, and they strongly depend on metal density and line width. The inhere
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::df7eefa136d5fede5b72d4191e8b8e20
https://doi.org/10.1117/12.816556
https://doi.org/10.1117/12.816556