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pro vyhledávání: '"Mohammed Elghazzali"'
Autor:
Lars Bottcher, Hirofumi Sawamoto, Ioannis Tsigaras, Roland Rettenmeier, Ewald Strolz, Friedrich-Leonhard Schein, Christian Voigt, Mohammed Elghazzali
Publikováno v:
2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
Within the advanced packaging technologies there is an increasing demand for very high I/O count solutions to fulfill requirements of high performance computing applications like big data analysis. Thus, the density of lateral and vertical interconne